Amphenol is a leading global interconnect solutions provider to the mobile networks market and offers a wide product portfolio, including antennas, connectors and interconnect systems. Our products are used in current and next-generation wireless communications standards, including in 5G networks. We works with service providers around the world to offer an array of antennas and installation-related site solution interconnect products. We provide solutions that span antenna systems, base stations, combiners, filters and amplifiers, core network controllers, distributed antenna systems (DAS), mobile switches, radio links, small cells and wireless routers.
Composite Mounting Platforms (CPAD)
Composite Pads (CPAD) are economical alternatives for poured in place and pre-cast concrete pads used to mount cabinets, generators, electric vehicle chargers, and other outdoor enclosures. They provide a flat, stable mounting surface and below-grade slack storage. One-piece and modular bay designs are available. Advanced composite material construction is both lightweight and rugged.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.
Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch DDCE connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single-piece connector can accommodate both high-speed and low-speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In- Card thicknesses.
The DPBP 70/3333-TETRA-N is a Duplex Bandpass Filter for the European Public Safety/mission-critical network called Tetra, but it can also highly be used for the P25 networks or LMR/PMR UHF450 (380-470 MHz) radio networks. It is specked to 200 W CW and benefits among others for having a very high TX/RX Isolation and a very low Insertion Loss due to a unique silver plating in the filter house.
FCI Basics D-Sub Accessories complement FCI Basics D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories includes plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, dust caps, and brackets.
FCI Basics D-Sub Cable Connectors span across signal and power applications in computer equipment, cash register, and high-end industrial cabinets. Signal connectors are available as removable crimp contacts, and power connectors in crimp, solder bucket, and wire wrap terminations.
DSUB CONNECTORS FOR CUSTOM APPLICATIONS
Amphenol has proven capability to work with customers and develop special product extensions to meet their custom applications. This can be to meet special polarization requirements, fitment to their special panel cabinets, extra standoff to meet the height requirements, assemblies for cable application, etc.
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
FCI Basics D-Sub High-Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly, and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
FCI Basics D-Sub High Performance Board-Mount Connectors are designed for severe environment applications in the field of telecommunications, aerospace, military (125°C) class and for particularly severe applications, especially high temperature (+155°C) class. They feature machined contacts and is available in solder bucket, straight spills, angled spills, and wire wrap terminations.
FCI Basics D-Sub Standard Board Mount Connectors are standard density I/O products widely across various market segments. The stamp and rolled contacts complementing the full metal shells are available in solder, straight, and angled versions. They also come with single-shell (Delta-D) and double-shell designs.
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
EazyPwr™ IP67 field-installable connector provides the next generation of custom power with up to 125A per contact. The metal latching system ensures a reliable connection between the mated pair. The water-tight plug and screw-on cap can be removed easily. Wide range of customizable components to fit specific application needs. Rubber sealing provides IP67 protection.
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
SV Microwave’s new Edge-Lock PCB connector series is designed to pull the connector's contact lane into the edge of the PCB. The result is a fixture-less connector that is primed for reflow without any unnecessary custom fixtures to hold the connector in place. The secure fit between the connector and the PCB edge ensures optimal RF performance throughout the connector's full frequency range.
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
E-Series features tray-based, total front access fiber distribution panels. E-Series gives cost-effective patch, patch/splice, and splice-only capabilities in an industry-standard ETSI footprint. The series can host up to 144 terminations in a standard configuration that fits existing frame layouts and new builds.
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.
ExaMAX® 56Gb/s High Speed Backplane Cable Assembly
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.
The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
Amphenol has developed the ExtremePort™ Swift connector which is used in the application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in the current market to save space in the end device.
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol’s Extremeport Z-Link(Gen Z ) Connector is a scalable connector and connector interface compliant to SNIA: SFF-TA-1002. Z-Link can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. Z-Link can support high speed and power in one connector, and we developed 1C, 2C, 4C, and 4C+ connectors to support customers' different applications.
Building on the legacy of MIL-PRF-28876, the F-143 incorporates the latest technologies in fiber optic interconnect design. The backshells feature the Quickloc™ captivation system, developed by AFSI, that is easy to install, easy to remove the captivated aramid yarn of the cable, and recapture without cutting back the cable.
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.
FFC/FPC Connectors with Autolock Mechanism - F308/F332 Series (0.50mm pitch)
F308/F332 series is a 0.50mm pitch right angle Non-ZIF flex connector with an auto-lock mechanism and surface mount termination. It features a height of 2.45mm and comes in 6 to 68 contacts. This series features a cable thickness of 0.33mm and provides the durability of 20 mating cycles. Its robust connector design makes it suitable for robotic operations, supporting Industry 4.0.
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.
The FDE enclosure has a low profile, side-by-side door design that provides an ideal environment for splicing and patching in indoor wall-mount applications. An integrated access door on the customer side of the enclosure provides a generous opening for a cleaning tool to reach the optical connectors, resulting in a more craft-friendly design.
Made for mobile applications - the cable drum with universal cable. Stretches can be used in protected indoor areas or in the field. The flexible cable sheath is designed for multiple uses. In addition, the reinforced cable sheath ensures increased tensile and transverse compressive strength. The cable could be assembled with a wide range of connectors, standard as well as more special ones.
The FSB series of indoor wall mount enclosures are designed for centralized splice-only applications. These boxes are well suited as optical cable splice collection points for DAS (Distribution Antenna Systems), MTU (Multi-Tenant Unit), commercial business applications, and MDU (Multi-Dwelling Unit) residential fiber network applications.
Borne from the foundation of D38999 mil-spec harsh environment connectors, the FTTA interconnect solution combines standard fiber optic LC components and copper contacts in a rugged, affordable package. The FTTA series is highly configurable to support a wide range of industrial applications where fiber and copper connectivity are required in a single connector.