Amphenol is a leading global interconnect solutions provider to the mobile networks market and offers a wide product portfolio, including antennas, connectors and interconnect systems. Our products are used in current and next-generation wireless communications standards, including in 5G networks. We works with service providers around the world to offer an array of antennas and installation-related site solution interconnect products. We provide solutions that span antenna systems, base stations, combiners, filters and amplifiers, core network controllers, distributed antenna systems (DAS), mobile switches, radio links, small cells and wireless routers.
Cluster Jumper Cable
MQ8 PCB mount connector with 8 ports blind mate multi coaxial cable assembly.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
SV Microwave’s high-performance RF/coaxial SMPM & SMPS multiport PCB connectors are ideal for high frequency printed circuit board applications where precision is key. These connectors enable extremely high frequencies (DC up to 100 GHz) while maintaining the smallest form factor.
Amphenol RF terminators are available in many common series and genders including; 1.0/2.3, APC-3.5, APC-5.5, BNC, F-type, HD-BNC, N-Type, QMA, and SMA. Amphenol RF terminators reliably prevent RF signals from being reflected along the transmission line to reduce interference.
The PRO-TRI 174/380-520/760-960 is a Triplex Filter (Multiplexer) used for combining /splitting 3 LMR/PMR radios, a VHF, a UHF, and an LTE to/from just one antenna. It comes in 2 versions both with SMA connectors, one for low/medium power up to 30 W per radio and one for high power radios up to 150 W per channel.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
Compact Universal Enclosures were designed around the principle of “flexibility.” These versatile enclosures may be wall, pole, strand or pedestal-mounted and configured to meet a variety of fiber, copper, or coaxial distribution applications. With a universal backplane and interchangeable feed and drop cable port plates, they are especially efficient at meeting FTTX deployment challenges.
Amphenol CTI manufactures wire harnesses and cable assembly solutions of any complexity for a broad range of industries and applications. Certifications: UL, CSA, ISO9001, CE, IPC620, WHMA, C-TPAT, IATF16949. Capabilities: Complex circuits counts / 70+ ft long / Harsh environment / Complex branching & bundling / Splices / Braiding. Tooled for many major interconnect suppliers
Composite Pads (CPAD) are economical alternatives for poured in place and pre-cast concrete pads used to mount cabinets, generators, electric vehicle chargers, and other outdoor enclosures. They provide a flat, stable mounting surface and below-grade slack storage. One-piece and modular bay designs are available. Advanced composite material construction is both lightweight and rugged.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.