Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
Over-braided cable assemblies for the Military and Commercial Aerospace markets. Braiding material, which improves overall EMI performance, includes Stainless Steel, Tinned Copper, and Aluminum. Braiding materials such as Nylon and Nomex are used for cable jacketing and vary based on operating temperature.
Amphenol-CTI overmolding technologies work in many applications; offering the best-value solutions to your interconnect challenges. Certifications: UL, CSA, ISO9001, CE, IPC 620, WHMA, C-TPAT, IATF16949 (and others) Capabilities: Multi-conductor data cables (DVI, HDMI, USB, etc) / Filtered Power / Custom molds / Soft or hard tooled, 3D printing molds / Single/multiple cavities / PVC/PP/ABS/TPU/PBT
Amphenol manufactures various whip and stubby antennas utilizing in-house single/dual shot injection molding and insert molding processes for single and multiband frequencies. Various connector interfaces can be selected for custom applications.
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Pad Mount Equipment Cabinets (CUBE PM Series) are designed specifically to protect high-density installations of network equipment in outdoor environments and are ideal for wireless, wireline, and utility and applications. Various thermal options are available to ensure equipment is protected in all environments.
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.