Board-Level Connectors

Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles and right angle headers are offered in 9-69 positions.

Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.

Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.

Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 64 GT/s Gen 6 capabilities. Slim connector design saves space on the motherboard while facilitating other higherdensity applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.

The Amphenol Cool Express Link™ is a range of EDSFF E3 Hybrid Orthogonal Press-fit PCIe® Gen 5/6 Cable Connectors that supports low latency, high bandwidth, and high throughput data transmission for existing and next-gen storage and CXL 3.1 applications. Engineered for use in high-performance computing applications in artificial intelligence and machine learning that require advanced enterprise storage...

Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.

Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.

FCI Basics Cross-Mate™ series is a wire-to-board system that offers compact design and active latching for applications requiring good mating retention.The particular cross section of the mating area guarantees a reliable 4 point contact interface with an improved current rating from 2A to 4A per contact. Terminal-Position-Assurance (TPA) guarantee that the contact is properly mounted into the cable housing

DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.

DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.

Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.

HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.

DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.

COMPLIES TO JEDEC SO-032 SPEC The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins/666 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides dual channel memory which could support higher bandwidth and can catch up all DDR5 capacities needed. This connector is developed to support lower-power DDR5 memory and does not require ground shielding.

COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023 The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.

LATEST MEMORY FORM FACTOR FOR AI SERVERS The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.

HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector are available in various height options.

Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges. With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.

HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields

DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.

DIN 41612 High Temperature (HT) connectors meet the fire safety standards required in the Industrial (Transportation, Power) market. DIN is most suitable for hazardous and high-risk product platforms of fire safety applications required in the industrial market. The 2.54mm pitch HT connectors comply with the relevant standards like IEC 603-2, NFF 16-101/102, and EN45545-2.

SUPPORTS 10/100T, 1GT, 2.5G, 5G, AND 10G TRANSMISSION SPEEDS WITH 2 & 4 PAIR POE UP TO 140W The Discrete Magnetic Series can offer a variety of products that can support 10/100T, 1GT, 2.5G, 5G & 10G transmission speed. It supports 2 & 4 pair PoE up to 140W. Configurations of both through-hole and SMT type are available for soldering process application.