High Speed Connectors

Slim Cool Edge Hybrid Power & Signal connectors provide a one-piece high speed and high power card-edge package. These connectors offer cost-competitive and high-density solutions. These versatile solutions based on a 0.65mm signal pitch design offer multiple BTB configurations like right angle, mezzanine, and coplanar. The connectors are designed as Open Pin Field & are hot-plug capable.

PROVEN, HIGH SPEED, NEXT-GENERATION SAS-4 INTERFACE SlimSAS™ connectors address issues in next-generation storage devices such as bulk cable form factor restrictions and the introduction of multi-lane storage devices. SlimSAS™ connector is a 0.60mm pitch interconnect system that offers superior signal integrity performance over standard Mini-SAS solutions.

In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed SlimSAS™ low profile connector which is used in application of UPI1.0, 11.2GT/s, 24Gb/s SAS signal or 16GT/s PCIe® signal. With 0.60mm contact pitch, Low Profile (LP) SlimSAS™ solutions are smaller than mainstream connectors in current market to save space in end devices.

TVµCom-10Gb+ combines 10 Gb/s Ethernet speed of the classic µCom-10Gb+ with the ruggedness of 38999 Series III shell. TVµCom-10Gb+ exceeds 10Gb/s according to the IEEE 802.3an-2006, 10GBase-T standard, and the 38999 series III size 11 shell provides environmental resistance similar to MIL-DTL-38999 Series III.

Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.

Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.

DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.

The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.

DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.

ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.