High Speed Connectors

This optical transceiver comes with a maximum link length of 100m on OM4 multimode fiber and is capable of a 400Gb/s data rate with each channel transmitting up to 53.125Gb/s. The module also features outstanding BER and high sensitivity because of its reliable design and excellent coupling efficiency. It is compliant with IEEE 802.3cm, QSFP DD CIMS 4.0, and QSFP DD Hardware 5.1.

AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.

Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backward mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.

HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.

AirMax VS® high-speed signal connectors from Amphenol ICC meet the dimensional and electrical requirements described in the Compact PCI® Serial (PICMG CPCI-s.0) Specification developed by the PCI Industrial Computer Manufacturers Group (PICMG). Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles.

AirMax VS® coplanar connectors permit mating two boards in the same plane. The AirMax family includes many coplanar configurations including 3-, 4- and 5-Pair per column connectors with column pitch of 2mm and 3mm. This family also includes 100 Ohms versions for the broad market as well as 85Ohms versions for other computer architectures. These connectors can accommodate 12.5Gb/s applications.

AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.

AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.

AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.

The Aptera™ connector meets difficult electronic packaging challenges with a high-speed interconnect designed specifically for space-constrained areas without impeding airflow. Aptera's™ pin assignments are not predetermined, providing more flexibility when it comes to PCB routing design. It features low crosstalk that supports 6.25Gb/s data rates.

ASGTC-Quadrax is a special circular bayonet coupling connector for data line transmission in RMT application, It's IP67 protection and with a self-locking system specially designed in order to get heavy duty application, Q-contacts with the protection of copper body and multipoints band in female contact to provide to 360º shielding.

Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.

CA Series™ high performance 32 Gb/s+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high-speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface without offset requirements. These connectors offer enhanced reliability even under extreme conditions.

Combines our extensive legacy of Mil-Spec connectors with the latest in high-speed technology, providing both a durable and high-bandwidth system that supports data rates up to 56 Gbps in a lightweight, aluminum MIL-DTL-38999 shell.

Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.

Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.

Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.

With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.

The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.

µCom-10Gb+ Series connector is designed to meet the latest market trends of the industry: miniaturization and high speed. µCom-10Gb+ design of 4 twisted data pairs insulated throughout the entire connector results in a performance that exceeds IEEE 802.3an-2006 specifications for 10GBASE-T Ethernet and TIA/EIA-568-C.2 Cat6 standards.