High Speed Connectors

The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.

Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.

Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.

Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.

Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...

Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.

Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.

Amphenol has developed the ExtremePort™ Swift connector which is used in the application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in the current market to save space in the end device.

Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.

Reverse Bayonet modular connector GCB-M, as per VG95234, housing size 32, to take up to 4 modules as per EN4165 for contacts: AWG 23- AWG8, FO contacts (MTP, MPO), RJ45, coax, quadrax contacts.. More than 230,000 various pole arrangements are possible. These connectors are also available in Marinebronze and Zinc-Tin versions.

This series, featuring high-speed contacts, ruggedized harsh environment protection, metal reverse bayonet coupling, signal connector. With four Quadrax contacts per connector and bandwidth up to 1.25 GHz, a data rate exceeding 2.5 Gbps with a standard operating temperature from -55°C to +125°C.

HSC connector system is a fully shielded interconnect system that supports data rates up to 1Gb/s and more. With 0.50mm square terminals, it allows a lighter and smaller connector design. The comprehensive shielding of these connectors provides enhanced EMI performance. It is designed for automotive applications like LVDS, camera, USB, and IEEE 1394.

HSD connector system is a fully shielded interconnect system that can be used with shielded twisted quad cables. It has a high-performance digital system for low-voltage differential signals which prevents interference from crosstalk and external sources. It has the minimum size to satisfy global automotive requirements such as LVDS camera, USB, and IEEE 1394 applications.

Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is simple to manipulate, cost-effective, and time-saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.

The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.

The 300Gb/s Leap-AHRD High-Speed Optical Module is faster, smaller, more cost, and power-efficient than most conventional data center interconnects. The on-board transceiver rugged device is capable of speeds up to 25Gbps and distances up to 100 meters. The optical cable can be routed above and around other components in the integrated heat-sink design.

The Lynx™ connector is a flexible 0.6mm pitch solution designed for high speed and density differential or single-ended signaling BTB applications. Lynx™ has a robust contact design tolerant of misalignment, enables a reliable connection, and supports blind mating. This connector provides designers with a readily available 85Ω solution to meet a wide variety of application needs, including PCI.

Optimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers an innovative, high-performance interconnect with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and provides a 4-row differential signaling structure, in a compact 2-row footprint.

Micro Cool Edge NF1/NGSFF 0.50mm is a new small form factor card edge connector designed for enterprise and data center SSD (Solid State Drive) servers. It supports NF1/NGSFF (Next Generation Small Form Factor) which can double storage capacity and enable front side service within server systems compared to the M.2 standard.

Amphenol ICC introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.