High Speed Connectors

Explosion-proof Ethernet solutions for Zone 2 that are low-power non-sparking connectors.

Derived from standard RJF TV, Reduced Flange RJF TV is ideal for applications where small dimensions and lower weight are critical in harsh environments. RJFTV Reduced flange receptacle is available in Cat5.e, Cat.6 and Cat6A. With the patented RJStop system you can use a standard RJ45 cordset in a metallic plug that will protect it from shocks, dust, and fluids.

R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.

R-VPX High-Speed Evolution Modules are capable of 16+ Gbps data rate transfer performance. Evolution meets the performance requirements of VITA 46 & 47 while still intermateable with existing VITA 46 backplane connectors. This connector system is optimized for speed and ruggedized to handle harsh environment requirements in military applications across the board.

R-VPX Evolution 2.0 is the next generation of high-speed ruggedized backplane connectors. Evolution 2.0 series connectors are designed, optimized and qualified to data rates in excess of 32Gb/s making these connectors the fastest VITA 46.30 connectors in the world. They are tested to VITA levels and are backward intermateable with R-VPX, R-VPX EVO 1, and VITA 46 qualified connectors.

Amphenol's SFP product family supports applications for up to 6 Gbps per channel. The connector accepts multiple transceivers per INF-8074i and combines, transmits, and receives functions in a low-cost, compact format. The assemblies are designed to maximize valuable space on the PCB.

Data connector according to VG96912, shielded, in size 12 including backshell for High-Speed and Ethernet applications up to CAT6_A (10Gbit/s according to DIN EN 50173-1, up to 500 MHz).

With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting-edge BGA, LGA, and other small form factor IC applications. These sockets offer cycle lives of thousands of mating cycles. The electrical reliability & performance of our sockets can meet the most demanding application needs.

Slim Cool Edge Hybrid Power & Signal connectors provide a one-piece high speed and high power card-edge package. These connectors offer cost-competitive and high-density solutions. These versatile solutions based on a 0.65mm signal pitch design offer multiple BTB configurations like right angle, mezzanine, and coplanar. The connectors are designed as Open Pin Field & are hot-plug capable.

PROVEN, HIGH SPEED, NEXT-GENERATION SAS-4 INTERFACE SlimSAS™ connectors address issues in next-generation storage devices such as bulk cable form factor restrictions and the introduction of multi-lane storage devices. SlimSAS™ connector is a 0.60mm pitch interconnect system that offers superior signal integrity performance over standard Mini-SAS solutions.

Amphenol has developed SlimSAS™ low profile connector which is used in the application of UPI1.0, 11.2GT/s, 24Gb/s SAS signal, or 16GT/s PCIe® signal. With 0.60mm contact pitch, Low Profile (LP) SlimSAS™ solutions are smaller than mainstream connectors in current market to save space in end devices. LP SlimSAS™ was also called SlimSAS™ LP.

TVµCom-10Gb+ combines 10 Gb/s Ethernet speed of the classic µCom-10Gb+ with the ruggedness of 38999 Series III shell. TVµCom-10Gb+ exceeds 10Gb/s according to the IEEE 802.3an-2006, 10GBase-T standard, and the 38999 series III size 11 shell provides environmental resistance similar to MIL-DTL-38999 Series III.

Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.

Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.

DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.

The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.

DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.

ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.

XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.