High Speed Connectors

Miniature multi-pin USB3.0 connectors for harsh environments.

Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.

Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.

Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

CXP connector comes in a one-piece Press-Fit assembly that provides one-step placement to the board to accommodate single, ganged, or stacked connector configurations in high-density requirements. CXP system has twelve channels for up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba & the InfiniBand CXP12x QDR standards.

MIL-DTL-38999 connectors are ideally suited for shielded contacts for high-performance, high-speed interconnection applications. Insert arrangements can incorporate: coax (sizes 8, 12, and 16); twinax (sizes 8 and 12); and triax contacts (sizes 8, 10, and 12).

D38999 Series III Connectors are ideally suited for the incorporation of shielded contacts for high-performance, high-speed interconnection applications. Uses size 8 high-speed Quadrax and Differential Twinax contacts. A wide selection of connector shell styles and sizes are available. Transition adapters can be used to attach connectors with Quadrax or Differential Twinax contacts to PCBs.

Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.

The 0.80mm pitch DDCE connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single-piece connector can accommodate both high-speed and low-speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In- Card thicknesses.

DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.

ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

Amphenol Air LB France's SIM module for RJ45 Cat6a 10Gb can be used with the whole range of EN4165 / SIM Monomodule connectors. Available for cable-to-cable or cable-to-PCB applications. Rear accessories are available to provide a sealed connection.

The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.

The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.

The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.

The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.

ExaMAX® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.

The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.

The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.