High Speed Connectors

Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.

CA Series™ high performance 32 Gb/s+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high-speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface without offset requirements. These connectors offer enhanced reliability even under extreme conditions.

Combines our extensive legacy of Mil-Spec connectors with the latest in high-speed technology, providing both a durable and high-bandwidth system that supports data rates up to 56 Gbps in a lightweight, aluminum MIL-DTL-38999 shell.

Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.

Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.

Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.

With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.

HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.

µCom-10Gb+ Series connector is designed to meet the latest market trends of the industry: miniaturization and high speed. µCom-10Gb+ design of 4 twisted data pairs insulated throughout the entire connector results in a performance that exceeds IEEE 802.3an-2006 specifications for 10GBASE-T Ethernet and TIA/EIA-568-C.2 Cat6 standards.

Miniature multi-pin USB3.0 connectors for harsh environments.