High Speed Connectors

The Mini-SAS external I/O connector consists of a die-cast metal cage and a Compact Multi-Lane SMT connector. It supports Fiber Channel & InfiniBand standards, making it the perfect solution to the ever-growing demand for high-speed mass storage systems, servers & storage area networks. Providing four serial send/receive channels/ports, this connector provides signal speeds of 6 Gbps/channel.

Amphenol's external mini-SAS / SATA connector, cage, and cable assembly system solution addresses the storage industry's demand for more compact, high-speed serial I/O interfaces that also support evolving signal speed requirements.

Mini-SAS High-Density receptacle is the next-gen SAS system; the SAS 2.1 standard meets SAS-3 next-gen speed & density requirements that provide faster data transmission & more bandwidth for end users. The low-profile system provides 4X and 8X cable-plug options & the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.

NEXT-GENERATION SAS STORAGE INTERFACE Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.

Micro-miniature solution ideal for communications systems running Gigabit Ethernet, USB 2.0/USB 3.0, HDMI, and 10 Gigabit Ethernet when specified and designated to a specific configuration.

56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.

Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.

High-speed data transmission up to 10 Gbps per pair. MIL-DTL-38999 shell styles are available from size 9 to 25. A wide variety of insert arrangements is available. Patterns range from (1) to (21), 100 Ohm differential pairs capable of delivering data transfer speeds of 10Gbps per pair. PCB Tails contacts available, sockets only, epoxy backfilled.

Size 8 Octonet Contacts for MIL-DTL-38999 Series III connectors. Available in size 8 crimp termination style, including PC tails. Can be installed in existing size 8 Quadrax cavities. Meets performance specifications of CAT-6A cable. Overall higher bandwidth than standard CAT5E Quadrax-supports up to 4.0 Gbps per pair. 10G Ethernet compliant.

Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.