High Speed Connectors

CA Series™ high performance 32 Gb/s+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high-speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface without offset requirements. These connectors offer enhanced reliability even under extreme conditions.

Combines our extensive legacy of Mil-Spec connectors with the latest in high-speed technology, providing both a durable and high-bandwidth system that supports data rates up to 56 Gbps in a lightweight, aluminum MIL-DTL-38999 shell.

Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.

Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.

Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.

With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.

HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.

µCom-10Gb+ Series connector is designed to meet the latest market trends of the industry: miniaturization and high speed. µCom-10Gb+ design of 4 twisted data pairs insulated throughout the entire connector results in a performance that exceeds IEEE 802.3an-2006 specifications for 10GBASE-T Ethernet and TIA/EIA-568-C.2 Cat6 standards.

Miniature multi-pin USB3.0 connectors for harsh environments.

The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...

MIL-DTL-38999 connectors are ideally suited for shielded contacts for high-performance, high-speed interconnection applications. Insert arrangements can incorporate: coax (sizes 8, 12, and 16); twinax (sizes 8 and 12); and triax contacts (sizes 8, 10, and 12).