High Speed Connectors

Amphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports up to 112Gb/s PAM4 aggregate bandwidth with a backward compatibility for next generation Ethernet and Fibre Channel applications. The ExtremePort™ SFP112G connector shares the same unique mating interface and EMI cage dimensions as the SFP+

Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.

In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed ExtremePort™ Swift connector which is used in application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in current market to save space in end device.

Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.

Reverse Bayonet modular connector GCB-M, as per VG95234, housing size 32, to take up to 4 modules as per EN4165 for contacts: AWG 23- AWG8, FO contacts (MTP, MPO), RJ45, coax, quadrax contacts.. More than 230,000 various pole arrangements are possible. These connectors are also available in Marinebronze and Zinc-Tin versions.

This series, featuring high-speed contacts, ruggedized harsh environment protection, metal reverse bayonet coupling, signal connector. With four Quadrax contacts per connector and bandwidth up to 1.25 GHz, a data rate exceeding 2.5 Gbps with a standard operating temperature from -55°C to +125°C.

PCIE® GEN 6 BACKPLANE INTERCONNECT SYSTEM The HD Express® is a high-density, high-performance interconnect system designed to meet and exceed PCIe® Gen 6 electrical and mechanical requirements for high-end 85Ω architectures.

HSC connector system is a fully shielded interconnect system that supports data rates up to 1Gb/s and more. With 0.50mm square terminals, it allows a lighter and smaller connector design. The comprehensive shielding of these connectors provides enhanced EMI performance. It is designed for automotive applications like LVDS, camera, USB, and IEEE 1394.

HSD connector system is a fully shielded interconnect system that can be used with shielded twisted quad cables. It has a high-performance digital system for low-voltage differential signals which prevents interference from crosstalk and external sources. It has the minimum size to satisfy global automotive requirements such as LVDS camera, USB, and IEEE 1394 applications.

Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is simple to manipulate, cost-effective, and time-saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.

The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.