High Speed Connectors
GT Quadrax
This series, featuring high-speed contacts, ruggedized harsh environment protection, metal reverse bayonet coupling, signal connector. With four Quadrax contacts per connector and bandwidth up to 1.25 GHz, a data rate exceeding 2.5 Gbps with a standard operating temperature from -55°C to +125°C.
HSC Connector System
HSC connector system is a fully shielded interconnect system that supports data rates up to 1Gb/s and more. With 0.50mm square terminals, it allows a lighter and smaller connector design. The comprehensive shielding of these connectors provides enhanced EMI performance. It is designed for automotive applications like LVDS, camera, USB, and IEEE 1394.
HSD (High Speed Data) Connector System
HSD connector system is a fully shielded interconnect system that can be used with shielded twisted quad cables. It has a high-performance digital system for low-voltage differential signals which prevents interference from crosstalk and external sources. It has the minimum size to satisfy global automotive requirements such as LVDS camera, USB, and IEEE 1394 applications.
ICFP
Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is simple to manipulate, cost-effective, and time-saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.
InfinX®
The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.
Leap-AHRD
The 300Gb/s Leap-AHRD High-Speed Optical Module is faster, smaller, more cost, and power-efficient than most conventional data center interconnects. The on-board transceiver rugged device is capable of speeds up to 25Gbps and distances up to 100 meters. The optical cable can be routed above and around other components in the integrated heat-sink design.
Lynx™
The Lynx™ connector is a flexible 0.6mm pitch solution designed for high speed and density differential or single-ended signaling BTB applications. Lynx™ has a robust contact design tolerant of misalignment, enables a reliable connection, and supports blind mating. This connector provides designers with a readily available 85Ω solution to meet a wide variety of application needs, including PCI.
Lynx™ QD
Optimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers an innovative, high-performance interconnect with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and provides a 4-row differential signaling structure, in a compact 2-row footprint.
Micro Cool Edge NF1/NGSFF 0.50mm Connectors
Micro Cool Edge NF1/NGSFF 0.50mm is a new small form factor card edge connector designed for enterprise and data center SSD (Solid State Drive) servers. It supports NF1/NGSFF (Next Generation Small Form Factor) which can double storage capacity and enable front side service within server systems compared to the M.2 standard.
Mini Cool Edge IO
Amphenol ICC introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Mini-SAS
The Mini-SAS external I/O connector consists of a die-cast metal cage and a Compact Multi-Lane SMT connector. It supports Fiber Channel & InfiniBand standards, making it the perfect solution to the ever-growing demand for high-speed mass storage systems, servers & storage area networks. Providing four serial send/receive channels/ports, this connector provides signal speeds of 6 Gbps/channel.
Mini-SAS Connectors
Amphenol's external mini-SAS / SATA connector, cage, and cable assembly system solution addresses the storage industry's demand for more compact, high-speed serial I/O interfaces that also support evolving signal speed requirements.
Mini-SAS HD
Mini-SAS High-Density receptacle is the next-gen SAS system; the SAS 2.1 standard meets SAS-3 next-gen speed & density requirements that provide faster data transmission & more bandwidth for end users. The low-profile system provides 4X and 8X cable-plug options & the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Mini-SAS HD Internal
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
MRC (Multi-Media Ruggedized Connectors)
Micro-miniature solution ideal for communications systems running Gigabit Ethernet, USB 2.0/USB 3.0, HDMI, and 10 Gigabit Ethernet when specified and designated to a specific configuration.
M-Series™ 56
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.
NeXLev®
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
OCS - Oval Contact System Connectors
High-speed data transmission up to 10 Gbps per pair. MIL-DTL-38999 shell styles are available from size 9 to 25. A wide variety of insert arrangements is available. Patterns range from (1) to (21), 100 Ohm differential pairs capable of delivering data transfer speeds of 10Gbps per pair. PCB Tails contacts available, sockets only, epoxy backfilled.
Octonet Contacts
Size 8 Octonet Contacts for MIL-DTL-38999 Series III connectors. Available in size 8 crimp termination style, including PC tails. Can be installed in existing size 8 Quadrax cavities. Meets performance specifications of CAT-6A cable. Overall higher bandwidth than standard CAT5E Quadrax-supports up to 4.0 Gbps per pair. 10G Ethernet compliant.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
QSFP DD
Amphenol's QSFP DD interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface. It is one of the industry's leading multi-lane pluggable form factors used across Ethernet, Fibre Channel, and InfiniBand.
RCx
RCx is a simple, high density, low cost, passive connector and cable system specifically designed for intra-rack connectivity of 25 Gb, 50 Gb, and 100 Gb Ethernet allowing for a seamless intra-rack switch to adapter deployments. RCx is density optimized and can accommodate more than 128/25 Gbps lanes in a RU faceplate.
Rectangular Connectors with High Speed Contacts
Offer several advantages for high data transfer rates, low power consumption, and excellent EMI compatibility. Variety of plated, aluminum shell styles available. Quadrax, Split Pair Quadrax, or Differential Twinax available. Board Level connectors can incorporate straight or PCB Tails right angle, or straight compliant tail contacts.
RJF 544
RJF 544 allows you to use an Ethernet Class D / Cat 5e connection for 10 BaseT, 100 BaseTX, or 1000 BaseT networks in harsh environments. With the patented RJStop® system you can use a standard RJ45 cordset in a protective composite plug which will protect it from shocks, dust, and fluids. No hazardous on-field cabling and grounding!
RJF Cat5e, Cat6, Cat6A (New Cat6A version)
RJF Cat6A allows you to use an Ethernet Class Ea / Cat. 6A connection for 10 BaseT, 100 BaseTx, 1000 BaseT, or 10 G BaseT up to 500 MHz networks in harsh environments. With the patented RJStop system you can use a standard RJ45 cordset in a metallic plug that will protect it from shocks, dust, and fluids. No hazardous on-field cabling and grounding!
RJF RB
Ethernet RJ45 connection system for industrial harsh environment.
RJF TV ATEX Zone 2 versions
Explosion-proof Ethernet solutions for Zone 2 that are low-power non-sparking connectors.
RJF TV Cat5e, Cat6, Cat6A – Reduced flange receptacle
Derived from standard RJF TV, Reduced Flange RJF TV is ideal for applications where small dimensions and lower weight are critical in harsh environments. RJFTV Reduced flange receptacle is available in Cat5.e, Cat.6 and Cat6A. With the patented RJStop system you can use a standard RJ45 cordset in a metallic plug that will protect it from shocks, dust, and fluids.
R-VPX
R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.
R-VPX Evolution
R-VPX High-Speed Evolution Modules are capable of 16+ Gbps data rate transfer performance. Evolution meets the performance requirements of VITA 46 & 47 while still intermateable with existing VITA 46 backplane connectors. This connector system is optimized for speed and ruggedized to handle harsh environment requirements in military applications across the board.
R-VPX Evolution 2.0
R-VPX Evolution 2.0 is the next generation of high-speed ruggedized backplane connectors. Evolution 2.0 series connectors are designed, optimized and qualified to data rates in excess of 32Gb/s making these connectors the fastest VITA 46.30 connectors in the world. They are tested to VITA levels and are backward intermateable with R-VPX, R-VPX EVO 1, and VITA 46 qualified connectors.
SFP
Amphenol's SFP product family supports applications for up to 6 Gbps per channel. The connector accepts multiple transceivers per INF-8074i and combines, transmits, and receives functions in a low-cost, compact format. The assemblies are designed to maximize valuable space on the PCB.
SJT Data Connector
Data connector according to VG96912, shielded, in size 12 including backshell for High-Speed and Ethernet applications up to CAT6A (10Gbit/s according to DIN EN 50173-1, up to 500 MHz).
SK Series - Sockets
With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting-edge BGA, LGA, and other small form factor IC applications. These sockets offer cycle lives of thousands of mating cycles. The electrical reliability & performance of our sockets can meet the most demanding application needs.
Slim Cool Edge 0.65mm Hybrid Power & Signal Connectors
Slim Cool Edge Hybrid Power & Signal connectors provide a one-piece high speed and high power card-edge package. These connectors offer cost-competitive and high-density solutions. These versatile solutions based on a 0.65mm signal pitch design offer multiple BTB configurations like right angle, mezzanine, and coplanar. The connectors are designed as Open Pin Field & are hot-plug capable.
SlimSAS™
PROVEN, HIGH SPEED, NEXT-GENERATION SAS-4 INTERFACE
SlimSAS™ connectors address issues in next-generation storage devices such as bulk cable form factor restrictions and the introduction of multi-lane storage devices. SlimSAS™ connector is a 0.60mm pitch interconnect system that offers superior signal integrity performance over standard Mini-SAS solutions.
SlimSAS™ Low Profile Connectors - U10 Series
Amphenol has developed SlimSAS™ low profile connector which is used in the application of UPI1.0, 11.2GT/s, 24Gb/s SAS signal, or 16GT/s PCIe® signal. With 0.60mm contact pitch, Low Profile (LP) SlimSAS™ solutions are smaller than mainstream connectors in current market to save space in end devices. LP SlimSAS™ was also called SlimSAS™ LP.
TVµCom 10 Gb+
TVµCom-10Gb+ combines 10 Gb/s Ethernet speed of the classic µCom-10Gb+ with the ruggedness of 38999 Series III shell. TVµCom-10Gb+ exceeds 10Gb/s according to the IEEE 802.3an-2006, 10GBase-T standard, and the 38999 series III size 11 shell provides environmental resistance similar to MIL-DTL-38999 Series III.
UltraPort™ QSFP+
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
UltraPort™ SFP+
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
X2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
XCede I/O
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
XCede Plus Backplane Connector
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
XCede® Backplane Connector
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
XCede® HD
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.