Connectors
Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
View our businesses providing Connector solutions.![Product OSFP](https://staph.blob.core.windows.net/images-products/OSFP-9867.png)
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
![Product OSP - AOM](https://staph.blob.core.windows.net/images-products/osp-aom-6551.png)
OSP - AOM
ABS expands the capacity of fiber with a DWDM solution that combines simplicity, security, and reliability. The OSP-AOM along with the HiDT has been designed to handle high channel counts in a package that exploits and expands the capacity of many of the most popular OSP closures.
![Product OverPass™ QSFP+](https://staph.blob.core.windows.net/images-products/OverPassT-QSFPPlus-6649.png)
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
![Product Paladin® 112Gb/s Backplane Connector](https://staph.blob.core.windows.net/images-products/PaladinR-112Gb-s-Backplane-Connector-8142.png)
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
![Product Paladin® Cabled Backplane](https://staph.blob.core.windows.net/images-products/PaladinR-Cabled-Backplane-4590.png)
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
![Product Paladin® HD 112G Backplane Interconnect System](https://staph.blob.core.windows.net/images-products/paladinr-hd-112g-backplane-interconnect-system-8304.png)
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
![Product PC/104 Connector](https://staph.blob.core.windows.net/images-products/PC-104-Connector-9270.png)
PC/104 Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 is a modular, ruggedized version of the PC 2.54mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
![Product PC/104 Plus Connector](https://staph.blob.core.windows.net/images-products/PC-104-Plus-Connector-9388.png)
PC/104 Plus Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 Plus is a modular, ruggedized version of the PC 2.00mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
![Product PCI](https://staph.blob.core.windows.net/images-products/PCI-Thumbnail.png)
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
![Product PCIe® M.2 Gen 3 and Gen 4 Card Edge Connectors](https://staph.blob.core.windows.net/images-products/PCIeR-M-2-Gen-3-and-Gen-4-Card-Edge-Connectors-3617.png)
PCIe® M.2 Gen 3 and Gen 4 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0, and SATA 3.0 applications, making it suitable for tablets, laptops, and low-profile storage and server applications.