Connectors
Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
View our businesses providing Connector solutions.
Waterproof I/O Connectors
Amphenol develops waterproof I/O connectors for mobile and wearable devices including smartphones, rugged mobile phones, smartwatches, and fitness bands where the environment requires protection at Ipx7 or even Ipx8 levels. Our range of waterproof products covers micro-USB connectors, AudioJack connectors, and the more recent USB Type C connectors.
Waterproof Micro USB 2.0
Amphenol's Waterproof Micro USB 2.0 comes with full shielding that protects against Electromagnetic Interference (EMI), Radio-Frequency Interference (RFI), and Electromagnetic Discharge (ESD). The USB connector supports fast charging with 1.8A power contacts and is capable to support up to 3A for customized needs. These halogen-free connectors meet IPX4 industry ratings.
Waterproof RF Adapters (IP68 Rated)
Amphenol SV Microwave offers a wide range of IP67 and IP68 waterproof interconnect products designed to withstand rigorous environments and harsh elements. SV's waterproof adapters include hermetically sealed connectors to 1 x 10-8 cc/sec, making them ideal for high-pressure, vacuum applications, and the prevention of liquid or gas leakage.
Waterproof USB Type C
SCALABLE, SUPERSPEED CONNECTOR SYSTEM
Waterproof USB Type C with IPX8 performance supports a variety of protocols such as USB 2.0, USB 3.2 Gen 1, USB 3.2 Gen 2 and meets high-speed communication and power delivery (20V, 5A). The usability of Waterproof Type C is with strong IP performance and unique IP technology to ensure each part meets the high quality of waterproof performance.
WireLock®
WireLock® is a 1.80mm pitch wire-to-board connector system. Its compact design addresses the growing need for space-saving automotive-grade connectors. WireLock® is a double row connector system offering four coding types with different colors.
Wire Protector System
This series is economical PCB terminal blocks, which mainly take 2P/3P as the base pole and can be combined into any desired pole according to customers' requirements. With anti-vibration characteristics, flexible and convenient connection mode. Space 2.50mm-10.16mm, product design in line with IEC/EN60998, IEC/EN60947-7-4, UL1059, CSA C2.22 No.158, and other international standards.
Wire-to-Board Connector System (1.20mm pitch)
FCI Basics 1.20mm wire-to-board connector system is low profile and compact with 3, 4, and 6 pin counts. The plug and receptacle use a frictional mating method enabling up to 20 mating cycles.
The enclosed receptacle makes sure that the side entry matings are secure in tight spaces. Additional polarized key slots prevent any misalignment between the plug and receptacle.
Wire-to-Board Connector System (1.25mm pitch)
FCI Basics 1.25mm wire-to-board connector system is designed for a wide variety of applications in Industrial, Automotive, and Consumer markets. The comprehensive range consists of terminals, crimp housings, and PCB headers in straight and RA, SMT, and through-hole configurations. It is available in 2 to 15 circuits in a single row. 1.25mm WTB solution conforms to the EU Industry Safety Standard.
X2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
XCede I/O
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
XCede Plus Backplane Connector
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
XCede® Backplane Connector
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
XCede® HD
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
XCede® HD Plus
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
XCede® Power Connectors
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.
XFP
XFP is a 30pos 0.8mm pitch SMT receptacle designed to support 10 Gigabit Fibre Channel and Gigabit Ethernet with the ability to extend performance to 14 Gbps. It is constructed from a metal frame and the cage assembly is to be bezel-mounted to an I/O panel with compliant pins for pressing onto the host PCB. Its single row cage configuration requires less space & is cost-optimized.
XFP 10G Transceivers
XFP 10G optical transceivers include SR, LR, ER, ZR and support Duplex, BiDi, CWDM, and DWDM solutions. They adopt an LC interface and are compatible with IEEE802.3ae, XFP MSA, and other standards. XFP 10G optical transceivers have the characteristics of low power consumption, small size, and high speed. They are most commonly used in Transmission, Storage Area Networks, and other environments.
X-LOK Push-Lock Connectors
Amphenol LTW's X-Lok Series connectors are presented in various sizes for power, signal, and hybrid applications for fast, simple, and reliable connections. Features a push-lock mechanism for intuitive mating with AUDIBLE and TACTILE feedback.
YK50B & YK44B - Barrier Terminal Blocks
YK50B & YK44B are designed with nuts with greater screw torque and prevent torsion from reaching the terminal when screwing. The structure is simple and firm, and the connection is safe and reliable.