Search Results for barklip

Amphenol is gearing up to showcase its high-performance AI product offerings and demonstrate the vital role of connectivity in AI and ML applications at the AI Hardware Summit 2023.

Amphenol will showcase its innovative interconnect solutions at SPS 2024 in Nuremberg (Nov 12-14). Visit us at Hall 10, Booth 210 to explore our wide range of products designed to enhance automation and connectivity in various industries.

The much-anticipated ECOC Exhibition 2023 is just around the corner, and with an impressive lineup of state-of-the-art connectivity solutions, Amphenol will be there for you at Booth #412 from October 2 nd to October 4 th at the Scottish Event Campus in Glasgow, Scotland.. Here's a brief glimpse of the star products that will be on display:

The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions. As industries race toward the future, the demand for high-speed interconnects capable of handling the data deluge becomes more pressing.

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets

Amphenol OCP 48V compliant Barklip BK500 power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards.

Amphenol’s latest addition to its list of interconnect solutions with best-in-class mechanical and signal integrity performance is the DensiStak ™ Board-to-Board Connector.This connector is a solution that addresses the need for flexible pin design, high-density and compact interconnects, especially in challenging environments like automotive applications.

Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...

Automotive World is a leading global exhibition in automotive electronics, covering technologies like connected cars, autonomous driving, EV/HV/FCV, and MaaS. This year, 2023, the event will be held at Tokyo, Japan. Both Automotive OEMs and Tier 1 suppliers are among the 1,420 exhibitors, 70K visitors, and 170 speakers expected to attend the event.

Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display.

Amphenol is introducing its new Minitek® TPA connectors, which is enhanced with Terminal Position Assurance (TPA) features, making it a great choice for consumer applications, that require electrical continuity and safeguards against any issues caused by improper assembly.

When it comes to the digital age consumers, comfort and convenience are never compromised. Modern ML not only recognizes but predicts. AI algorithms can predict possible failures and prevent their occurrence in myriads of applications ranging from navigation assistance that helps us with a quick com

Minitek ® Pwr 4.2 High Current Connector:. Amphenol's Minitek ® Pwr 4.2 High Current Connector is designed to handle high current applications in medical therapeutic devices. With a current rating of up to 13A per contact, these connectors provide robust and versatile power connectivity. They are available in various configurations, including wire-to-wire and wire-to-board, making them ...

Amphenol is set to make a significant presence felt at the highly anticipated Open Data Center Committee Summit (ODCC) 2023, slated to be held at the Beijing International Convention Center from September 13 to September 14 at booth A06.. The ODCC Summit, a prominent event in China's Data Center landscape, brings together key players in the field.

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars Video The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5 ...

Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today, the release of its BarKlip ® BK500 IO and BarKlip ® BK150 IO busbar connectors. These high-current connectors are fully compliant with OCP ORv3 power output and IT gear specifications supporting 48V power rack architecture

DIN 41612 is a comprehensive backplane offering from Amphenol ICC with a legacy of nearly five decades.With a broad range of DIN 41612 styles; these connectors has an edge over other backplane connector solutions in terms of mass deployment specifically in Industrial and Instrumentation sectors.

Barklip IO (5) Coolpower (5) D-Sub Connectors (5) High Speed Connectors (5) Interior Lighting (5) MEZZOSTAK (5) Open Compute Project (5) SAS PCIe (5) Zhaga Book 20 (5) Amphenol Cables on Demand (5) High Speed Backplane ...

The need for high-speed connectivity is more pronounced than ever in this era of the Internet and interconnected systems. Cables and connector solutions have evolved to perform better than ever to support fast-paced information networks.