Search Results for barklip

Ever since, these flash memory cards have pedaled through various evolutions in the process of meeting the industry trends. The latest addition to this family is the microSD Express, which is expected to escalate the future of our data-hungry world to the next level.

Three new products were added to the Amphenol product array in February. FCI Basics BergStak HS ™ connector family known for its fast data transmission, high signal quality, and time-proven reliability was extended with two new additions including BergStak HS ™ 0.80mm and BergStak ® 0.50mm self-alignment connectors.

10137002-101lf | Amphenol Global Search | Amphenol Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars Video The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire ...

In modern energy scenarios, managing energy is a major challenge, be it an energy surplus or energy deficiency occurring at the generation, storage or distribution level. With advancing technologies, there are hopeful and innovative solutions that make this challenge easier to tackle. One such solut

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

DesignCon 2019 will offer more than 100 technical sessions, panel discussions, and tutorials spanning 15 tracks over the 3-day conference program.

The BarKlip ® BK150, a power solution busbar connector, features 10 independent points of contact with low resistance and high reliability. JavaScript seems to be disabled in your browser. For the best experience on our site, be sure to turn on Javascript in your browser.

Amphenol ICC is excited to participate in the SPS show again in 2019. Our team will be showcasing the latest power products designed for the industrial market, including PwrBlade ULTRA ® and BarKlip ® I/O solutions.

The global automotive industry is passing through massive transitions each day. Driving is much more to consumers than a means of mobility. From high-speed data connectivity and infotainment to person-identification sensors and autonomous driving, the smart cars of today have a handful of features to offer.

Open Compute Project (OCP) is making more efficient and scalable hardware and creating a new image for IT infrastructure. Every year OCP Global Summit will bring together expert developers, suppliers, engineers, executives and decision-makers around the globe to showcase and discuss the amazing technological enhancements happening in the world.

Amphenol's OCP 48V compliant BarKlip ® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards.

Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars Video The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5 ...

InterBattery Korea is one of the most important trade fairs for the production and development of rechargeable batteries and has served as an exclusive business platform for the industry’s potential prospects ever since it was first launched in 2013.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

With a 2.00mm pitch, Minitek ® is compatible with all types of connections between cables, wires, and PCBs. This design has helped to save up to 38% space compared with the conventional 2.54mm design. Minitek ® product range is so extensive and modular that it can be used for all types of wire-to-board, board-to-board, and cable-to-board interconnections on this pitch size.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

Amphenol BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact bea.

As another year wraps up, it makes us so proud to look back and see how fabulously we had managed the most challenging of our times. With over 40 new product launches, 8000+ parts created, and with a handful of advanced application solutions, 2021 had been a splendid year for Amphenol.

The 5G spectrum is enabling a new arena of intelligent infrastructure and a fully connected world. To meet the demanding requirements of modern mobile connectivity, each 5G component is redefined with enhanced performance, flexibility, scalability, and efficiency. We have discussed in our previous articles how Amphenol supports the strategic changes put forth by the fifth generation of ...