Search Results for cstack

10142344-108KLF. MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, Staggered, Top latch, 8 Ways

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions CTOL ...

A new application with advanced features using cutting edge technology is being introduced to the market every other day. This, in turn is mounting the requirement of high speed high reliable connector solutions. PCI Express (PCIe®) is a popular standard for various applications from small, mobile

Control cabinets are vertical enclosures with servo drives and other electromechanical components that control or monitor machinery and factory systems associated with it. The control cabinet is a stainless steel box, which can either be wall-mounted or a standalone module on the floor.

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

Amphenol ICC’s solutions meet or exceed data center convergence expectations. HCI’s non-volatile memory specs call for connectors like U.3 based out of SFF-TA-1001 and Mini Cool Edge based out of SFF-TA-1002 standards.

Amphenol ICC provides a wide range of connector solutions for all types of video surveillance cameras. Our RJMG connectors with Power over Ethernet (PoE) capabilities interface the recorders with the video outlets.

The instruments used to test various parameters defining the flawless performance of an application or gears are commonly termed as test and measurement equipment.

Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol . San Francisco, CA – (September 27, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions and SnapEDA, the first search engine for electronic design, are releasing over 21,000 new digital models to help designers bring ...

Amphenol was proud to exhibit at LightFair, in Las Vegas, Nevada, for the first time. It was an engaging three-day experience that brought together over 320 exhibitors, including lighting design and technology manufacturers, innovators, and professionals from around the globe

Amphenol ICC has a comprehensive range of connectors ranging from 0.40mm to 5.70mm pitch. The 2.54mm pitch connector family is generally used in electronic equipment or devices requiring a parallel, planar or perpendicular board/wire-to-board interconnect.

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions Current Sensors ...

The convergence and virtualization trends of modern Data Center storage are extending their scope to meet next generation requirements. The article gives a brief on modern practices and future technologies that will meet the demands of advanced Data Center storage. Modern storage architectures

ODCC Summit 2019 is just a few days away. Like previous years, Amphenol ICC is extending a wide variety of solutions in the Summit. Read on to learn more about our showcase this year.

The mating cycles of a connector are directly related to its resistance. If a connector has a low threshold, it indicates fewer mating cycles, while the ones with higher threshold will have a longer life in terms of mating.

The annual ODCC Summit is one of China’s leading Data Center events. Amphenol as an active member of the ODCC Committee will showcase our latest technologies, solutions, and achievements in the China data center industry this year. The 2022 ODCC Summit will be held in Beijing International Conventi

Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. Unlike earlier days when memory modules were designed specifically to meet ...

The Solid State Drive (SSD) market is expected to grow rapidly in 2019. Amphenol ICC’s 68 position SAS/PCIe 4.0, connectors come with 16GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers.

Join us at electronica China 2024, one of the leading international trade fairs for the electronics industry. This annual event will occur at the prestigious Shanghai New International Expo Centre in Shanghai from July 8 to July 10. As a proud exhibitor, Team Amphenol is excited to invite you to our

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions Current Sensors ...