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Amphenol has been at the forefront of backplane assembly design and manufacturing for over 30 years. The industry’s leading connectors and backplane systems can be traced back to Amphenol.

Amphenol Communication Solutions will be participating in the upcoming RE+ event, taking place from September 11th to 14th at the prestigious Venetian Hotel in Las Vegas, NV. You can find us at Booth #7932 on Level 2 of the Sands (Venetian) Expo.

electronica China, the biggest trade fair for electronic solutions is a few days away. Have a sneak-peek into Amphenol’s start products in Industrial 4.0 and 5G applications.

Serial Advanced Technology Attachment commonly known as SATA is an IDE (Integrated Drive Electronics) standard for storage devices like optic cables, HDDs, and SSDs connected to motherboards in computers. Though the technology is much advanced with storage standards like SAS and NVMe SATA is a definite choice in many applications.

cStack Flex (2) floating board-to-board connectors (2) plating (2) Blind Mate Interface (2) Chameleon (2) CompactPCI (2) Control Cabinet (2) Cross Mate (2) Data Communication (2) EDSFF CABLE ASSEMBLIES (2) InfinX (2) LVDS (2) Micro USB Connectors (2) Minitek MicroSpaceXS (2) Modular Jack (2) Smart Security (2) USB 2.0 Connectors (2) UltraPass ...

The Flash Memory Summit in Santa Clara is the largest event for flash memory and other high-speed memory technologies. The event brings together exhibitors from various sectors including design and components in non-volatile memory technologies and consumer electronics around the globe.

The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end..

Want to save space, while maintaining power and signal flow? Check out our brand-new, cost-effective ComboStak connector.Whether you need it for a mobile network, data center, industrial or automotive application, ComboStak's space-efficient, and high-current capacity will ensure a compact, yet reliable board-to-board connection.

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons

2024 is touted to see the release of the latest Wi-Fi standard, the 802.11be or Wi-Fi 7. It aims to deliver extremely high throughput (EHT). The latest addition is set to revolutionize wireless transmission with its 4.8x faster speed than Wi-Fi 6, better efficiency, deterministic latency, and higher

Amphenol is set to participate in the ECOC 2024, one of the premier events in the fiber optic communication technology industry. The European Conference on Optical Communication or the ECOC 2024, is scheduled to take place from September 22-26, 2024, at the Congress Center Messe Frankfurt in Germany. Celebrating its 50th anniversary, ECOC 2024 will bring together over 1,600 attendees, 30 ...

The evolution of cars, our most widely used mode of transportation, is a remarkable sight to behold. In just a few years, technology that was once only seen in race cars or even aviation is now commonplace in everyday sedans and SUVs.

cStackTM フレキ基板 アセンブリ システム cStack TM フレキ基板アセンブリは、特許取得のcStackコネクタ*が半田結線不要でフレキと基板を接続し、 インピーダンス制御を取りつつ、高速伝送をローコストで実現します。