Search Results for cstack

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

DDR- SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors.

Data usage is increasing every year, and the communications industry is working diligently to support the increased demand. This article discusses why we need more data, what data center physical layer architecture changes are needed to support higher data rates, and how Amphenol is well positioned to support higher data rate systems.

Amphenol is set to participate in the ECOC 2024, one of the premier events in the fiber optic communication technology industry. The European Conference on Optical Communication or the ECOC 2024, is scheduled to take place from September 22-26, 2024, at the Congress Center Messe Frankfurt in Germany. Celebrating its 50th anniversary, ECOC 2024 will bring together over 1,600 attendees, 30 ...

The stage is set, and Amphenol is all geared up to showcase its trailblazing technologies at Electronica India 2023, to be held from September 13 th to 15 th in Bangalore, India.This premier event promises to be an exhilarating showcase of the latest advancements in the electronics industry, and you can catch us in Hall 5 – Booth #EE91.. Unveiling India Manufacturing Capabilities:

The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions. As industries race toward the future, the demand for high-speed interconnects capable of handling the data deluge becomes more pressing.

cStack | Mezzanine Connectors | Amphenol Signal integrity data rates up to 25Gb/s with future technology roadmap up 50+Gb/s; Excellent performance in a low profile footprint; Low cost, high speed board and flex stacking products are available in 25 to 100 position standard sizes in addition to custom and larger sizes; Allows for the utmost ...

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions CTOL ...

Amphenol is set to participate in the ECOC 2024, one of the premier events in the fiber optic communication technology industry. The European Conference on Optical Communication or the ECOC 2024, is scheduled to take place from September 22-26, 2024, at the Congress Center Messe Frankfurt in Germany.

Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display.

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions Current Sensors ...

The HSD connector system (High-Speed Data), compliant with USCAR-2 specification, is a fully shielded interconnect system designed for transmitting high-performance digital signals at low voltages. It is built to prevent interference from both external sources and crosstalk. This system is widely used in various functions in automobiles such as ADAS, Body Control Units, Cameras, GPS, Security ...

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

0.50mm FFC/FPC Connectors. The 0.50mm pitch FFC/FPC connectors come in multiple heights and are vibration-proof. These connectors offered with top, bottom, dual beams and dual contact positions in both ZIF (Zero Insertion Force) and Non-ZIF cable terminations utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications.

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

In the ever-evolving landscape of technology and electronics, staying ahead of the curve is imperative. Enter the PwrBlade ® Mini Cable-to-Board and Board-to-Board Connectors, an innovative addition to Amphenol's renowned PwrBlade ® product line. These connectors are set to redefine power and signal transmission in low-profile applications, offering a range of features designed to meet the ...

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

Enterprise Server Solution Providers Launches EDSFF, OCP, Power Shelf and PCIe ® DirectAttached ® Cable Solutions. Singapore, March 4, 2023 – Amphenol Communications Solutions is pleased to announce today, the release of its high-speed cable solutions with options to meet PCIe ®, EDSFF, OCP specifications, and power shelf requirements. In close collaboration with the PCI-SIG association ...