Search Results for cstack
Shielded Connectors for Industrial Applications - Amphenol CS
BergStak ® 0.80mm Shielded Connectors. Bergstak ® shielded connector with 0.80mm pitch is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. The shielded design of these connectors provides superior EMC performance and significantly reduces coupling inductance leading to excellent electromagnetic compatibility.
DDR SDRAM - Evolution of High-Performance Volatile Memory - Amphenol CS
DDR- SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors.
Onboard Charger for Electric Vehicles - Amphenol CS
The FlexFast™ Flex-to-Board connector has a compact design that meets the increasing demands for flex-to-board solutions in automotive applications. It is compliant with USCAR T3V2 and LV-214 S1 specifications and features gold-plated terminals to reduce mating force. The connector has a low mating and un-mating force, a maximum height of 8.0mm, and is space-saving.
IT Datacom | Markets | Amphenol
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer ...
Amphenol showcases its leading high speed interconnect at DesignCon 2024
As the tech world converges in the heart of innovation at the Santa Clara Convention Center on January 31 st and February 1 st, 2024 for DesignCon, Amphenol will make a mark with pioneering solutions in interconnect technologies at Booth #833.. Date: January 31 st and February 1 st Time: 11 AM - 6 PM Venue: Santa Clara Convention Center, Great America Parkway, Santa Clara, CA
Types of Memory Modules and Their Applications - Amphenol CS
Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. Unlike earlier days when memory modules were designed specifically to meet ...
ExaMAX2® Connector System: Elevating Performance and Compatibility in ...
In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.
Spectrum® シリーズ|製品情報|アンフェノールジャパン株式会社 -航空宇宙・産業機器用コネクタ-
Spectrum® シリーズ. カタログ; Spectrum ®シリーズは、極めて微細なピッチを可能にするcStack™技術を使い、パルスロック®やCam-Lok嵌合方式のコネクタにおいて、高密度な芯数配列を実現します。 44AWGという極細線のワイヤを結線する技術により、軽量コンパクトな丸型もしくはリニア形状の ...
Amphenol’s Exciting Demos at OFC 2024
Come Join us at OFC Booth #2513 from 26th – 28th March 2024 at San Diego Convention Center, San Diego, California to experience these live demonstrations and to explore our extensive portfolio of advanced interconnects.
Amphenol Cables on Demand: Unparalleled Quality, Unmatched Service
Amphenol Cables on Demand is more than just a cable provider; it's a reliable partner in innovation. With a commitment to quality, customization, and unmatched industry partnerships, ACD stands at the forefront of the cable industry.
OSFP – Defining a New Standard for High-Speed Connections - Amphenol CS
Amphenol’s OSFP product portfolio offers customers a comprehensive and integrated link solution that features DAC copper cables, AOCs, stacked and ganged board connector and cage solutions.
Exploring the Future of Storage with EDSFF E1/E3 High-Speed Solutions
The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end.. Ideal for high-speed computing data center server systems, this solution eliminates ...
The DensiStak™ Connector: Advancing Connectivity Solutions - Amphenol CS
Amphenol’s latest addition to its list of interconnect solutions with best-in-class mechanical and signal integrity performance is the DensiStak ™ Board-to-Board Connector.This connector is a solution that addresses the need for flexible pin design, high-density and compact interconnects, especially in challenging environments like automotive applications.
Tag Archives: LV214 - Amphenol CS
Automotive Industry Standards are standards that define the connector requirements in terms of temperature, vibration, sealing and many other characteristics in an automobile application.
Standards Defining Reliable Automotive - Amphenol CS
Our latest high-performance automotive grade products like Ve-NET™ Automotive Multigigabit Differential Connector System, 0.50mm Power Pin Floating Board-to-Board Connectors, 0.50mm FFC/FPC Connectors with Autolock Mechanism - F308/F332 Series, FlexLock® FPC-to-Board Connector, and HSBridge+ connector complies with USCAR2.. LVDS stands for Low-Voltage Differential Signaling and is a global ...
Gen Z – The Next Gen Computing Architecture - Amphenol CS
Gen Z is a new open-system interconnect consortium aiming at providing advanced memory access to data and device.
IT Datacom | Markets - Amphenol
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer ...
FFC/FPC Connectors in Compact Applications - Amphenol CS
From first generation computers that were the size of a large room down to micro-miniature computers that confine to our palm, we have witnessed, how technological innovations have shrunk to target compact solutions while maintaining the extra edge in performance.
Enabling Connector Innovations through Plating - Amphenol CS
Plating technology defines the mating cycles, durability and performance of connectors. GXT ®, AGT ®, and GCS ® are innovative plating solutions that create durable, reliable, and economical connectors with increased efficiency.. GXT ® plating, a mix of palladium-nickel with gold flash was developed back in the 1980s. It has continuously met Telecordia performance requirements for the past ...
Fundamentals of Board-to-Board Connectors - Amphenol CS
cStack Flex (2) floating board-to-board connectors (2) plating (2) Blind Mate Interface (2) Chameleon (2) CompactPCI (2) Control Cabinet (2) Cross Mate (2) Data Communication (2) EDSFF CABLE ASSEMBLIES (2) InfinX (2) LVDS (2) Micro USB Connectors (2) Minitek MicroSpaceXS (2) Modular Jack (2) Smart Security (2) USB 2.0 Connectors (2) UltraPass ...