Search Results for cstack

DDR- SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors.

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Amphenol Communications Solutions CTOL ...

25% Increase in Current Density Compared to Existing Card Edge Designs! The NEW 3000W EnergyEdge ™ X-treme Card Edge series offers the highest linear density available in the market today. X-treme’s revolutionary dual contact design pushes the boundaries of card edge technology beyond 3000W to power modern system architectures.

Batteries are the lifeline of any electric vehicle. Lithium-ion cell packs predominantly store energy in EVs, large battery-based unmanned aerial vehicles like drones, and portable devices that require reliable, compact, and high power sources.

Amphenol’s new M.2 Gen 5 connectors are much more advanced than their predecessors and can meet PCI Express® 5.0 specifications. Supporting higher data rates up to 32Gb/s and occupy lesser board space compared to the PCIe® Mini Card connector, they are capable of supporting multiple add-in cards lik

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer ...

FCI Basics is the leader in Wire-to-Board Signal Solutions. Building on the strengths of FCI connectors, whom Amphenol acquired in 2016, FCI Basics continues this legacy providing robust, modular, compact connector solutions to anticipate and meet the needs of exponentially rising data rates and minimising signal losses at the time of insertion.

Medical devices to e-vehicles, power tools and, military wearable units, today there are numerous lightweight portable applications powered by battery available in the market.

Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer ...

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

Battery Storage System is at the heart of the ESS. Amphenol has Busbar connectors and cables as well as Input Output solutions going into 48V / 1000V / 1500V Lithium ion battery racks. Our BarKlip ® connectors offer the smallest 150A+ ESS solution in the market with a high current rating of up to 160A /200 /300A per contact @ 30°C T-Rise. With a wire range of 8AWG-0AWG, these connectors ...

Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer ...

Amphenol's high density, cost effective cLGA and cStack solutions provide both a heat-sink opening and features for precise alignment of the interposers to the DMD and main PC Board. Use the documentation to the right to find the socket for the DMD for which you are designing.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

Millipacs Backplane Connectors. Compliant with IEC 917, IEC 61076-4-101 industry standards, and offering a 2.00 mm grid interconnection system, Millipacs ® is ideal for rugged environments. With features like two-beam twisted tulip contacts, EMI shielding, coding, guiding, and high operating temperature capabilities, these connectors excel in demanding medical-surgical applications, serving ...

PCB Layout For Standard D-Sub Connector (09 To 50) 10 PCB Layout For High Density D-Sub Connector (15 To 104) 11 – 33 Receptacle Crimp Type Connector & Approved Part No. List 34 Plug Crimp Type Connector & Approved Part No. List 35 – 56 Socket & Pin Contact Information (Crimp Type) 57 D-Sub Crimping & IR Tool 58 - 60

BergStak ® 0.80mm board-to-board connectors are an essential part of medical monitoring equipment, helping to realize space-saving and high-speed board-to-board connections between main boards and add-on boards. Featuring optional shielding to minimize EMI and meets the increasing trend to use BergStak on FPC cables for flexible connections to solve medical board design challenges.

International Suppliers Fair (IZB), which will take place from October 22 to 24, 2024, at the Allerpark in Wolfsburg, Germany, is a significant gathering for the automotive supply industry.It features around 800 exhibitors from various sectors and serves as a crucial venue for industry players to connect, showcase innovations, and explore new business opportunities in the automotive supply chain.