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Leading the Evolution of High-Speed Interconnect -DesignCon 2025
DesignCon 2025 is a premier event focused on high-speed communications and system design. It is a must-attend event for chip, board, and systems design engineers to network, source, and stay ahead of industry change. At Booth 833, attendees can interact with our experts and explore these demos:
Amphenol Corporation - Amphenol Corporation Completes Acquisition of ...
We are excited to welcome nearly 4,000 talented employees to the Amphenol family and look forward to further supporting our customers who are developing next-generation wireless networks around the world.
Telect Co-Founders Announce Retirement from Board of Directors
The entire Telect family wishes Bill and Judi many happy days going forward. As founders, their impact on the Spokane community and Telect employees past and present is significant. All who know them understand their gifts of strength, grace and unwavering faith.
Executive Leadership - Amphenol
Of our 22 executive leaders, six were born outside of the United States, four identify as under-represented minorities (Black or African American, Hispanic or Latinx, Asian, Native American or Alaska Native, Native Hawaiian or Pacific Islander, or Two or More Races or Ethnicities) and one identifies as LGBTQ+.
Sister Companies - RFS Technologies an Amphenol Company
As part of the global Amphenol family, RFS Technologies, Inc. has access to RF and Fiber Optics experts across the globe. Below is a list of sister companies with complementary products and expertise:
2024 Wrapped: What’s the Buzz at Amphenol this year?
In the energy market, the EnergyKlip ™ family of industrial battery module connectors utilizes high-current contact technology specifically tailored to meet the increasing demands of energy storage applications.
Amphenol Extends Product Portfolio with Aorora Aquisition
Amphenol Aorora is now part of the Amphenol Family. Amphenol ICC is extending our product portfolio of BTB/FFC/FPC connectors with the acquisition of Aorora Technology Co. Ltd. Based in Huizhou, China with 450 employees, Aorora, was founded in 2003 by Mr. Luo Liwen (CEO).
Amphenol's Rugged Connectors for Immersion Cooling Systems
Immersion cooling technology represents a revolutionary approach to thermal management in data centers, where servers are completely submerged in a specially designed dielectric fluid. This method offers several significant benefits over traditional air-cooling systems.
Amphenol Corporation - Amphenol Corporation Completes Acquisition of ...
WALLINGFORD, Conn.-- (BUSINESS WIRE)-- Amphenol Corporation (NYSE: APH) today announced it had completed the acquisition of the Carlisle Interconnect Technologies (CIT) business from Carlisle Companies Incorporated (NYSE: CSL).
Tag Archives: Paladin HD2 - Amphenol CS
PwrBlade® Connector Family - Celebrating 20 Years of Excellence. Welcome to the AICC Connect. Enabling Connector Innovations through Plating. Easy Mating with Blind Mate Interface (BMI) Tags. Events (51) Bergstak (34) Applications ...
Star-Line EX - Amphenol Fiber Systems International (AFSI)
A heavy duty environmentally sealed connector, these connectors have proven to provide exceptional performance in the most complex ground support cable network, automatic and process control systems and instrumentation systems. The Star-Line EX offers reliable connectivity in challenging conditions.
StructurePlus™ | Overmold Compatible Connectors - Amphenol Sine
Amphenol Sine Systems’ StructurePlus™ Family of overmold comparable connectors are an engineered, one-piece, solid body construction and are specifically designed for cable assembly operations requiring custom molding or shrink tube requirements.
Amphenol Communication Solutions Extends high-speed cable product ...
Amphenol's PCIe ® DirectAttached ® cable riser solution supports PCIe ® 5.0 data rate of 32Gb/s and reduces signal loss by replacing high-speed PCIe ® trace on the multi-layer motherboard with high-speed cable.
OSFP – Defining a New Standard for High-Speed Connections
Octal (8x) Small Form Factor Pluggable (OSFP) interface is the latest evolution of the SFF product range that meets the MSA norms. Amphenol’s OSFP product portfolio offers customers a comprehensive and integrated link solution that features DAC copper cables, AOCs, stacked and ganged board connector and cage solutions.
Amphenol at 2025 InterBattery, Korea
Amphenol will be participating in 2025 InterBattery in Seoul, Korea, from March 5-7. The 2025 InterBattery is Korea’s leading battery exhibition, showcasing new products and technologies related to the battery industry. 2025 InterBattery will host over 500 exhibitors and 80,000 attendees.
Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology
With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.
PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets
PCIe ® Gen 7.0 rises to this challenge by offering speed, and efficiency, making it an essential component for next-generation computing systems. Here is a look at its specifications from PCI-SIG: PCIe ® Gen 7 will deliver a raw bit rate of 128 GT/s, enabling bi-directional data transfer rates of up to 512 Gb/s when configured as x16.
Exploring the Evolution and Diversity of USB Connectors by Amphenol
From USB 2.0 to USB 4, Amphenol's connectors are designed to deliver high-speed transmissions, scalable power delivery, and backward compatibility, ensuring seamless connectivity across a wide range of devices. One of the defining features of Amphenol's USB connectors is their diversity.
Maximizing Network Efficiency with our High-Performing OSFP Connectors
OSFP is a groundbreaking form factor that supports eight high-speed electrical channels at 1.6 Tb/s (8x200G or 8x100G, 8x50G), and it can accommodate up to 32 ports per 1U front panel and 51.2 Tb/s per 1U swap slot. The OSFP optics are being developed to improve signal integrity and thermal performance to support the next generation optics also.
MicroSpaceXS™ Product Presentation - Amphenol CS
The Minitek MicroSpaceXSTM Crimp-to-Wire’s compact design addresses the growing demand for miniaturizing components. The connector is capable of reducing the PCB footprint by 50% due to the increase in signal density.