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www.amphenol-sine.com www.amphenol-sine.com BoardLock™ Family Comparison Chart Note: Refer to individual datasheets on www.amphenol-sine.com for full specs, faceviews, keying location and product dimensions. Series BoardLock ™ AT BoardLock ™ AT13/15 BoardLock ™ ATF13 Image Positions 2, 3, 4, 6, 8, 12 and 18 2, 4, 6, 8, 12, 13 and 18 2, 3, 4, 6, 8 and 12

Besides, card edge versions, our Busbar connectors from the BarKlip ® family support advanced applications in networks and telecommunications, including high power applications in hyperscale computing architectures using busbars for power distribution with a current-carrying capacity ranging from 100A to 300A.

Amphenol Sine Systems’ ever-growing A Series™ Family of sealed, heavy-duty, multi-pin plastic and metal connectors are made up of 20+ core product lines. The connectors within this Family have been developed as a high-performance, cost-effective solution for use with Heavy Equipment, Agricultural, Automotive, Military, Alternate Energy, and ...

Amphenol CS is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. Amphenol’s broad range of products enable design engineers to achieve their performance targets.

Advanced Automotive Electronics is taking the automobile industry to the next level with vehicles rich in features like ADAS, Autonomous Driving, Intelligent Navigation, and Infotainment. Aiming for a greener and eco-friendly ride Electric Vehicles are also on trend.

FAKRA CONNECTOR SERIES TABLE OF CONTENTS 09 21 04 Applications 08 10 13 15 11 03 06 Overview Technical Specifications Solder Reflow Process Cable Mount Construction Mating & Unmating

The ICA family is made up of five strategically located manufacturing facilities in the United States and Mexico, each with more than 20 years of experience. Our family of facility operations gives customers access to combined comprehensive resources: state-of-the-art manufacturing and testing equipment, exceptional engineering expertise, and ...

www.amphenol-sine.com Standard products. Custom solutions Customer Service +1 800 394 7732 www.amphenol-sine.com Updated 05/2022 1 of 8 HYPR BUSS ™ Family More Power. More Data. More Control. Amphenol Sine Systems’ HYPERBUSS™ Family of Receptacle Connectors are are a high-performance, cost-effective solution used in a variety of interconnect applications where a common “bussed ...

Family Positive locking system ensures the connectors are securely mated and prevents accidental un-mating . Tin 15µ"Gold 30µ"Gold Gold Flash Receptacle Housing (94 V-0) Tin 15µ"Gold 30µ"Gold PN 10142708 Vertical Through Hole Header Configuration Row Positions Plating Dual Dual Dual 2-12 2-12 2-12 10146997 Right Angle Through Hole

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

Multiple VPX specifications have been added to the VPX family of technologies since stemming from the founding of VITA 46 architecture. The VPX standard necessitates a variety of technologies, including: 3U and 6U formats ; High-speed backplane and module connectors rated up to 25 Gb/s+ ; Choice of high-speed serial fabrics; PMC and XMC mezzanines

New Product Integration (NPI) Solutions was founded in May 2000, by Kevin Andersen in the heart of Silicon Valley. Upon inception, the goal and focus of NPI was to become a leading provider of quality custom electronic assemblies at a reasonable price. Before founding NPI, Andersen spent years deeply enmeshed in the boom surrounding the development of personal computers and the demand for ...

Product Family. Paladin 2 items; ExaMAX 5 items; AirMax 7 items; XCede 4 items; VHDM 2 items; Elite 1 item; GbX 1 item; Crossbow 1 item; Data Rate. 224G 1 item; 112G 3 items; 56G 6 items; 28G 2 items; Below 28G 12 items; Apply Filters Reset All. View as List Grid. 24 Items . Show

HIGH DENSITY POWER AND SIGNAL CONNECTOR SYSTEM. The PwrMAX ® connector family offers a compact means for connecting up to 100A DC power in modern system architectures requiring high density and high current. Configurations include coplanar, backplane, mezzanine and orthogonal. 100A per contact

™ Family Technical Specifications Temperature Range Clear Enclosure: -40°C to +120°C Black Enclosure: -55°C to +125°C Ultem® (Transparent Amber) Encl: -55°C to +125°C AT/ATM Headers: -55°C to +125°C Temperature (Humidity) 320 Hr Temperature (Life) 1000 Hr UV Exposure 500 Hr Max. Current (AMP) 13A (AT Headers); 7.5A (ATM Headers)

Paladin's revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mat

™ Family Technical Specifications Temperature Range (Enclosures) Amber: Ultem® PEI -55°C to +125°C Black: Thermoplastic PA66 -55°C to +125°C Clear: Polycarbonate -55°C to +125°C Temperature Range (Headers) AT/ATM Headers: -55°C to +125°C Temperature (Humidity) 320 Hr Temperature (Life) 1000 Hr UV Exposure 500 Hr Max.

Heavy-Duty, Multi-Pin, 13A-25A, Thermoplastic Connectors. Available in 2, 3, 4, 6, 8, 12, 13 (Mixed), 15 (Mixed) and 18 position. Amphenol Sine Systems’ AT Series ...

™ Family Technical Specifications Temperature Range (Enclosures) Amber: Ultem® PEI -55°C to +125°C Black: Thermoplastic PA66 -55°C to +125°C Clear: Polycarbonate -55°C to +125°C Temperature Range (Headers) AT/ATM Headers: -55°C to +125°C Temperature (Humidity) 320 Hr Temperature (Life) 1000 Hr UV Exposure 500 Hr Max.

• Many of the TJSE family members have always been commercial parts that perform to the M81714 electrical and mechanical standards. Exceptions are noted in the List of Commercial Junction Modules with MilSpec Equivalent table. Amphenol Pcd Series II Commercial Socket Junction Modules Feedback, Feedthrough & Bussing Modules