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There's a Better Way... - Blog - amphenol-ns.com
Amphenol Network Solutions blog regarding company news, product launch news, and informational posts about our industry and products.
Cross Reference Products | Part Number Search | Amphenol CS
Search for an Exact Competitor Part number or type an “*” to search by partial Part Number. To Search Multiple Parts at once, copy/paste or type one part number per line. Example: Part number 1 Part number 2 Part number 3. Amphenol CS does not guarantee the suitability of the referenced product for the intended application.
Flex to Board | FPC-to-Board Connectors - Amphenol CS
Flex-to-board connectors are compatible with flex and rigid-flex PCBs, offering various termination options to suit different requirements. They can easily accommodate traditional thru-hole and surface-mount (SMT) connectors, Zero Insertion Force (ZIF) connectors, pin and socket connectors, and point-to-point or multi-branch connectorized jumpers.
Leap On Board Transceivers | OBT | Optical Interconnect - Amphenol CS
SMALL, FAST AND POWER EFFICIENT. Amphenol's 300Gb/s Leap ® High-Speed Optical Module is faster, smaller, and more cost and power efficient than most conventional datacenter interconnects. Supports non-standard protocols in this range of datarates. Note CDR operational bit rate of 25-25.8Gb/s.
Efficient Network Connection Solutions That Are Cost Effective
By thinking beyond long-accepted norms, ABS offers design solutions that are more cost effective for operators, more efficient for installers and more reliable for customers. Amphenol Broadband Solutions delivers solutions for every part of todays advanced networks.
Amphenol Network Solutions > Products | Amphenol Network Solutions ...
Telect designs and manufactures high-density frames, rack-mount bulkhead panels, tray-based solutions, wall or pole-mounted solutions, pre-configured equipment, and overhead and vertical cable management solutions. Choose Telect reliability, backed by NEBS certification. Our focus is to protect your fiber and data. Shop fiber products below.
CoolPower HD Vertical Cable-to-Board | Power Solutions | Amphenol
Its flexible, low-profile housing minimizes board space usage while optimizing airflow, making it well-suited for space-constrained applications. Additionally, the pull-to-release latching mechanism ensures reliable installation and secure connections.
Flexible Printed Circuit Assembly | FFC/FPC Connectors - Amphenol CS
BROAD OFFERING/HIGH PERFORMANCE/COST SAVING/CUSTOMIZED/VALUE ADDED FLEX CABLE ASSEMBLY. Amphenol's BergStak ®, MezzoStak ®, Conan ®, ComboStak ® and PowerStak ® are industry proven board-to-board solutions.
UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS
Alternatively, contact one of our authorized distributors from the listing here. 224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS. UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. Beginning of dialog window.
Technology - Amphenol Invotec
Flex-rigid circuit technology provides a method to integrate multiple PCB assemblies, eliminate wires, cables or connectors, replacing them with flexible substrate between rigid sections. Flexible circuits allow the board to conform to a desired shape (flex) during its application.
EXAMAX2 ® 112Gb/s High-Speed Backplane Connector - Amphenol CS
Supporting 112Gb/s PAM4 Performance. The EXAMAX2 ® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers.
Flex-to-Board: Compact and Reliable Interconnect Solutions - Amphenol CS
As devices continue to shrink, Amphenol’s Flex-to-Board solutions stand out, delivering exceptional performance in limited spaces. Amphenol’s Flex-to-Board portfolio includes: FlexFast ™ Flex-to-Board, FlexLock ™ Flex-to-Board & Flex-to-Wire, and Flexible Printed Circuit Assembly.
HD Express | Backplane Connector | Amphenol
PCIE® GEN 6 BACKPLANE INTERCONNECT SYSTEM. The HD Express ® is a high-density, high-performance interconnect system designed to meet and exceed PCIe ® Gen 6 electrical and mechanical requirements for high-end 85Ω architectures. Have any questions? Talk with us directly using LiveChat.
OSFP-XD Copper Cable Assemblies - Amphenol CS
Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities. These assemblies support a range of bandwidths, including 400G (16x25G), 800G (16x50G), 1.6T (16x100G), and 3.2T (16x200G) per cable, ensuring seamless integration with evolving technology standards.
FlexFast Mini Flex-to-Board - Amphenol
FlexFast™ Mini Flex-to-Board connector's compact design addresses the growing demand for the automotive applications market. The connector is designed to be compliant with USCAR and LV-214 specifications. The connector has a current carrying capacity of 1A per contact. FlexFast™ Mini 1.0mm pitch is available in a 22-position configuration.
PCI Express ® Gen 6 Flip CEM Card Edge Connectors
The PCI Express ® Gen 6 Flip CEM Card Edge Connectors offer a new 1.0mm pitch vertical card edge connector designed in line with PCIe ® mating interface standards. Unique to this model are the “JJ” and “LL” contact types, which allow for a 19.5% keep-out area savings.
ComboStak® 0.50mm & PowerStak® 2.00mm | Board-to-Board Connector | Amphenol
ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades.
UE36E1626042BE1 | QSFP DD | Amphenol
QSFP DD Cable Assembly, Passive, 32AWG, 1M, 112G / Lane, Flex Sleeve. NJYYER-0002. QSFP DD Cable Assembly, Passive, 30AWG, 2M, 112G / Lane, Flex Sleeve. Part Specification Detail. Part Specification Detail. The information below is for reference only. For more technical details, refer to product specification and application specification.
PCI Express ® Gen 6 DirectAttached™ CEM Card Edge Connectors
64GT/S NRZ DIFFERENTIAL SIGNALING FOR NEXT-GENERATION SYSTEMS. The PCI Express ® Gen 6 DirectAttached™ CEM Card Edge Connectors from Amphenol offer superior performance for next-generation systems.
BergStak ® Lite 0.80mm Board-to-Board Connector - Amphenol CS
ECONOMICAL OPTION FOR HIGH-DENSITY APPLICATIONS. Amphenol's BergStak ® Lite 0.8mm is a comprehensive, versatile and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions.