Automotive
Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation automobiles. Our primary solutions for automotive include antennas, electric vehicles, engine management and control, exhaust monitoring and cleaning, hybrid vehicles, infotainment and communications, lighting, power management, safety and security systems, sensing systems, telematics systems and transmission systems.
Lynx™ QD
Optimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers an innovative, high-performance interconnect with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and provides a 4-row differential signaling structure, in a compact 2-row footprint.
Magnetostrictive Linear Position Sensors
Temposonics is recognized as an industry leader in sensing technologies and solutions. These sensors permit precise and dynamic position and speed measurement in advanced automation and safety-relevant applications. With a versatile and ever-increasing product portfolio, Temposonics works closely with customers, to optimize performance and reduce downtimes.
Manual Service Disconnect (MSD)
MSD: Manual Service Disconnect, with safe, reliable solutions for servicing high voltage systems. it utilizes a two-stage lever to open the HVIL circuit prior to separation of high voltage contacts. This tool-free solution for disconnecting the internal HV battery pack and protecting the battery pack HV cables from short-circuiting is available in a scalable design with a variety of fuse ratings.
MCX Connector Series
The MCX (Micro Coaxial) series is a 50 Ω series with broadband capability ranging from DC to 6 GHz. In addition, the MCX series features secure, fast and easy snap-on/ snap-off coupling.
Mechanical Guidance Modules
Guidance modules assure proper connector alignment prior to connector engagement and are suitable for backplane, coplanar, or orthogonal midplane applications in Hard Metric environments. Modules fitting 20mm slot pitch complement AirMax® 4-Pair or 5-Pair modules or ZipLine 6-Pair signal modules.
Mechanical Switches
Mechanical Switches for openers designed for harsh environments with high durability and IP protection.
Mechatronic Components
We manufacture mechatronic components such as switches and pushbuttons using highly automated production systems.
Mechatronic Sub Assemblies
Automated assemblies of molded components for functional subsystems in accordance with customer requirements on quality and functionality.
Media Hub
Tecvox delivers one of the broadest portfolios of Media Hubs with a wide range of protocols and configurations to many of the leading automotive and truck manufacturers around the world. Data communications and USB charging in highly efficient, dynamic thermal controlled, compact modules.
MEG-Array®
The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.
1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights
MEG-Array® R+
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.
Metal Injection Molding
Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.
Metal Substitution - Weight Reduction
Customer and application-specific molded components to replace metal parts for weight reduction. Consulting regarding plastic-specific design and structural requirements, tool design, and tool building.
Mezzostak® 0.50mm Pitch 5.2mm Stacked Height
Mezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.50mm mezzanine connectors are available in 120 positions with other position options provided on request.
Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro-Bayonet
This series, a small footprint, lightweight, high contact density, stamped & formed crimp contact, IP54 rated metal bayonet coupling, signal connector. With three insert arrangements ranging from 7 to 15 contacts per connector and up to 3 amps possible with a standard operating temperature from -40°C to +125°C.
Micro SD and SD Card Sockets
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
Miniaturized Connectors
Reduced Space Connectors for Automotive Applications