Amphenol is a world leader in broadband communication products for cable, satellite and telecommunications video and data networks, with industry-leading engineering, design and manufacturing expertise. We offer a wide range of products to service the broadband market, from customer premises cable and interconnect devices to distribution cable and fiber optic components, as well as interconnect products integrated into headend equipment. Our solutions address high-speed telecommunications networks, customer premises equipment, high-speed internet hardware, network switching equipment, satellite interface devices and set-top boxes.
The TFOCA-III® series of 6 & 24-channel fiber optic connectors are ideal for environmentally harsh conditions. The TFOCA-III® design utilizes the latest technology in fiber optic connectivity by incorporating industry-standard physical contact ceramic ferrules and alignment sleeves.
The TFOCA-II® 12-ch. connector, designed and patented by AFSI, is ideal for environmentally harsh conditions and its design takes advantage of the latest technology by utilizing industry-standard physical contact ceramic ferrules. The TFOCA-II® connector is designed for minimal maintenance in the field, and its removable end cap allows direct access to the alignment sleeve and termini.
Tier Rated Underground Enclosures are made from Advanced Composite Material using a Resin Transfer Molding (RTM) process. Combining the design flexibility of RTM and the strength of advanced composite materials, TRUE grade level enclosures provide Tier 15 and 22 performance with ease of handling and installation. Exterior surfaces are finished with gel coat for a smooth, durable finish.
Amphenol's CooLink is an auto-grade high-speed cable for autonomous driving applications. CooLink can meet USCAR2 and LV214 spec, and high temperature up to 85℃, 105℃ and 130℃. CooLink can support PCIe Gen4 and Gen5, and is scalable to PCIe Gen6. We designed CooLink with CPA and a second lock feature to meet auto vibration tests.
Amphenol LP SlimSAS is a high-speed cable solution with low mating height, and it's a qualified cable solution by UPI1.0. LP SlimSAS can support PCIe Gen5, and its footprint is compatible with standard SlimSAS. Amphenol developed 38pin, 74pin and 124pin LP SlimSAS with straight, right-angle, and side exit plug types to provide customers a flexible system layout.
Amphenol's SlimSAS is a high-speed and robust cable assembly solution, and supports multiple industry applications such as PCIe, SAS, OpenCAPI, UPI1.0, OCP, NVME, and Ethernet. Amphenol has developed a scoop-proof connector solution with a pull tab. Amphenol develops a 38pin and 74pin solution and has been specified in the SFF group(SFF-8654).
Amphenol's USB4 is the most recent update of the USB specification and supports a range of higher video resolutions, high data bandwidth, power. The bandwidth capability is increased up to 40Gbps in two lanes. Amphenol's USB4 cable has passed the certification of USB4 Gen3 spec, and the TID number is 4266. The mechanical interface is compatible with USB3.2 and Type C.
Amphenol's VHDM® connector's modular format and breadth of components provide unmatched design flexibility. VHDM® can be combined with VHDM-HSD™ to incorporate both single-ended and differential signaling within the same connector. VHDM® derivatives provide an upgrade path to 25 Gb/s with backward mate compatibility to allow for scale as needed.
Wall / Pole Mount Cabinets are multi-chamber enclosures designed for traditional 19″ or 23″ rackmount equipment. Separate locking chambers offer a division of provider and customer equipment access. At cell sites and other multi-user locations, this division of access allows customers to service their equipment without the need to have the cabinet’s owner’s technician open the cabinet for them.
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
Amphenol LTW ZConnect® LV214-Compliant Connectors are low-profile connectors (8mm maximum mated height) for space-saving. ZConnect Connectors are robust enough to meet the automotive requirements of LV214 (VW75174). The series ranges from 8 to 40 contacts at 1A up to 120VDC with 0.9mm / 1.8mm / 2.7mm pitch. The connectors include mated and unmated versions and an IPx67 option.