IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
USB 3.1 GEN 2 Connector
FCI Basics USB 3.1 Gen 2 Type C connector delivers 2x the data transfer rate of SuperSpeed USB, as well as offers highly improved power efficiency. The next-generation form factor provides a multifunction single cable solution for data, power, audio, and video. Standard form-factor plug and receptacle performs up to 10Gb/s and power delivery up to 100W.
USB4 Type C Cables
Amphenol's USB4 is the most recent update of the USB specification and supports a range of higher video resolutions, high data bandwidth, power. The bandwidth capability is increased up to 40Gbps in two lanes. Amphenol's USB4 cable has passed the certification of USB4 Gen3 spec, and the TID number is 4266. The mechanical interface is compatible with USB3.2 and Type C.
USB Type C Connector and Cable Assembly
USB Type C standard receptacles provide multifunction single cable solutions for data, power, audio, and video. The small form factor made this interconnection a unquestioned technology across devices. The reversible design enables quick and easy connections, no matter which way it is inserted. 16-pin Type-C is a more economical solution to support 20V/5A 100W power charge & speed up to 480Mb/s.
VHDM-HSD™
VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.
Waterproof Micro USB 2.0
Amphenol's Waterproof Micro USB 2.0 comes with full shielding that protects against Electromagnetic Interference (EMI), Radio-Frequency Interference (RFI), and Electromagnetic Discharge (ESD). The USB connector supports fast charging with 1.8A power contacts and is capable to support up to 3A for customized needs. These halogen-free connectors meet IPX4 industry ratings.
Waterproof USB Type C
SCALABLE, SUPERSPEED CONNECTOR SYSTEM
Waterproof USB Type C with IPX8 performance supports a variety of protocols such as USB 2.0, USB 3.2 Gen 1, USB 3.2 Gen 2 and meets high-speed communication and power delivery (20V, 5A). The usability of Waterproof Type C is with strong IP performance and unique IP technology to ensure each part meets the high quality of waterproof performance.
WaveTrax Fiber Raceway
WaveTrax®, the Amphenol Network Solutions fiber raceway system, is designed to help engineers deliver reliable fiber optic network performance. Reduce your cost of ownership with the full line of WaveTrax products, including troughs, elbows, cross and T sections, off-ramps, and articulating links - easily installed so you are up and running quickly!
XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
XCede® HD Plus
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.