With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's DSFP cable assemblies are designed to support applications for Ethernet and Fibre Channel. The Amphenol DSFP products offer an ultra-high-performance, cost effective solution for 10G/25G/50G speed applications in switched fabric I/O, switches, routers, data storage arrays, and high-performance computer (HPC) clusters. The Small Form Factor Pluggable (SFP) interface supports a variety of commun...
Amphenol's D-Sub Accessories complement their D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories include plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, metal and plastic dust caps, and brackets .
In addition to a wide variety of D-Sub connectors, we offer a large assortment of Backshells, Locking Systems and Mounting Hardware. We also offer blind mate options, EMI covers, Sealing Options, and custom options to fit many different application requirements.
Amphenol CIT D-Sub & Micro-D filter connectors meet all the requirements of MIL-PRF-24308 and MIL-PRF-83513 while providing filtering in accordance with the attenuation curves noted herein. MIL-PRF-24308 connectors (Standard density and Hi-density) and MIL-PRF-83513 are manufactured in all layouts offering maximum contact density in a minimum of space.
Amphenol LTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68. The features are connectors interface meet ANSI / B93.55M-1981, Idiot-proof alignment key design【Quick Guide: https://amphenolltw.com/down.php?supp_download=93】
DSUB CONNECTORS FOR CUSTOM APPLICATIONS
Amphenol has proven capability to work with customers and develop special product extensions to meet their custom applications. This can be to meet special polarization requirements, fitment to their special panel cabinets, extra standoff to meet the height requirements, assemblies for cable application, etc.
DUAL PORT D-SUBMINIATURE CONNECTORS
Contact thickness options of gold flash, 15µ", and 30µ"
Up to 500 mating cycles
Various pin counts to choose from
Stacked configuration
HIGH DENSITY D-SUBMINIATURE CONNECTORS
Available in various sizes up to 78 positions
Endures temperatures up to 260°C
High density terminations include rear release crimp and solder cups for cable side, and Dip straight or R/A for board side
Tray packing available as standard and tube on request
HYBRID D-SUBMINIATURE CONNECTORS
Mating interface according to MIL C24308
Current rating of 7.5A for signal and 40A max. for power
Endures temperatures up to 260°C
Contact resistance less than 5mOhms
Up to 18 configurations of Signal, Power, and Coax contacts
Machined signal contacts are fixed in the insulator
Amphenol's D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost. The connector's compact footprint allows for more space ...
75A HIGH POWER CONTACTS WITH CRIMP, SOLDER BUCKET, AND PCB TERMINATIONS
Amphenol's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial...
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
D-Sub connectors are now available with Surface Mount Termination (SMT) in standard form factors. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate SMT soldering. The products are UL recognized and lead-free.
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
Available in a variety of shell sizes and insert arrangements for Power, Mixed Power/Signal, Coax, and RJ45 layouts. Amphenol Sine Systems’ ecomate® Aquarius Waterproof Connectors provide an IP67/69K waterproof rating when in a mated condition for industrial applications and incorporates the latest technology in high impact thermoplastic design, offering many advantages.
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
Amphenol CDI Edge Mount PCB Connectors provide high-performance RF signal transmission with a secure and space-efficient PCB mounting design. Engineered for aerospace, military, space, and industrial applications, these connectors offer low insertion loss, excellent impedance control, and superior shielding to ensure reliable connectivity in high-frequency environments.
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.