With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol ICC introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.
The Mini-SAS external I/O connector consists of a die-cast metal cage and a Compact Multi-Lane SMT connector. It supports Fiber Channel & InfiniBand standards, making it the perfect solution to the ever-growing demand for high-speed mass storage systems, servers & storage area networks. Providing four serial send/receive channels/ports, this connector provides signal speeds of 6 Gbps/channel.
Amphenol's external Mini-SAS cable assembly solutions address the current and legacy storage industry's demand for a reliable, compact, high-speed serial I/O supporting SAS 2.1. Mini-SAS solutions satisfy the applicable requirements of the INCITS T10 and SAS 2.1 specification and conform to the mechanical requirements described in the SFF-8086 and SFF-8088 documents.
Mini-SAS High-Density receptacle is the next-gen SAS system; the SAS 2.1 standard meets SAS-3 next-gen speed & density requirements that provide faster data transmission & more bandwidth for end users. The low-profile system provides 4X and 8X cable-plug options & the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Amphenol's Mini-SAS HD product is the present generation SAS storage interface addressing multi-channel bandwidth requirements of 6Gb/s, 12Gb/s, and 24Gb/s while meeting or exceeding SAS 2.1 SAS 3 and SAS 4 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS 2.1 product (19.01mm port-to-port).
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
FCI Basics Minitek127® standard board-to-board connector is the improved 1.27mm pitch modular system. The halogen-free product includes the straight, right-angle, and surface mount, post option for surface mount, different plating variations, and position numbers up to 100.
Minitek127® 1.27mm Wire/Cable-to-Board Connector System
FCI Basics Minitek127® 1.27mm connector system is an extensive range of modular connectors for all types of wire/ cable-to-board applications. It includes straight and right angle, surface mount and through-hole, pin headers and board receptacles in different plating variations, customized stacking headers, IDC version, available in up to 100 positions.
Minitek® Pwr 5.7 is a flexible and comprehensive solution for power application with a high current rating of up to 23A per contact and wire gauge range from 16-12AWG for wire-to-board application. Minitek® Pwr 5.7 features polarized mating geometry, this helps to prevent mismating. It offers a wide operating temperature, ranging from -40°C to 105°C, making it suitable for a range of applications.
FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking, and Home Entertainment markets for various applications. Modular Jacks Cat 3 supports the transmission of 16Mbps signals targeted to phone, modem, POS terminal machines and Cat 5 supports the transmission of 100Mbps signals targeted to switch, router, hub, etc.
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
Non-magnetic coaxial connectors are used to carry 50 ohm RF signals within the magnetic field of MRI equipment where a high signal-to-noise ratio (SNR) is required.
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.