IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Millipacs® Vertical Headers
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® Vertical Receptacles
FCI Basics Millipacs® is a 2.00mm modular, Board-To-Board or Cable-To-Board Interconnection system in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with options for the outer row.
Mini Cool Edge 0.60mm Connectors
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Mini Cool Edge IO
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional pcb routing methods.
Mini Power 4.2
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini Power Super
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.
Mini-SAS
The Mini-SAS external I/O connector consists of a die-cast metal cage and a Compact Multi-Lane SMT connector. It supports Fiber Channel & InfiniBand standards, making it the perfect solution to the ever-growing demand for high-speed mass storage systems, servers & storage area networks. Providing four serial send/receive channels/ports, this connector provides signal speeds of 6 Gbps/channel.
Mini-SAS Copper Cable Assemblies 3G/6G
Amphenol's external Mini-SAS cable assembly solutions address the current and legacy storage industry's demand for a reliable, compact, high-speed serial I/O supporting SAS 2.1. Mini-SAS solutions satisfy the applicable requirements of the INCITS T10 and SAS 2.1 specification and conform to the mechanical requirements described in the SFF-8086 and SFF-8088 documents.
Mini-SAS HD
Mini-SAS High-Density receptacle is the next-gen SAS system; the SAS 2.1 standard meets SAS-3 next-gen speed & density requirements that provide faster data transmission & more bandwidth for end users. The low-profile system provides 4X and 8X cable-plug options & the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Mini-SAS HD Copper Cable Assemblies 6G/12G/24G
Amphenol's Mini-SAS HD product is the present generation SAS storage interface addressing multi-channel bandwidth requirements of 6Gb/s, 12Gb/s, and 24Gb/s while meeting or exceeding SAS 2.1 SAS 3 and SAS 4 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS 2.1 product (19.01mm port-to-port).
Mini-SAS HD Internal
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
Minitek127® 1.27mm Board-to-Board
FCI Basics Minitek127® standard board-to-board connector is the improved 1.27mm pitch modular system. The halogen-free product includes the straight, right-angle, and surface mount, post option for surface mount, different plating variations, and position numbers up to 100.
Minitek127® 1.27mm Wire/Cable-to-Board Connector System
FCI Basics Minitek127® 1.27mm connector system is an extensive range of modular connectors for all types of wire/ cable-to-board applications. It includes straight and right angle, surface mount and through-hole, pin headers and board receptacles in different plating variations, customized stacking headers, IDC version, available in up to 100 positions.
Minitek® Pwr 5.7 Connector System
Minitek® Pwr 5.7 is a flexible and comprehensive solution for power application with a high current rating of up to 23A per contact and wire gauge range from 16-12AWG for wire-to-board application. Minitek® Pwr 5.7 features polarized mating geometry, this helps to prevent mismating. It offers a wide operating temperature, ranging from -40°C to 105°C, making it suitable for a range of applications.
Modular Jack - RJ45
FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking, and Home Entertainment markets for various applications. Modular Jacks Cat 3 supports the transmission of 16Mbps signals targeted to phone, modem, POS terminal machines and Cat 5 supports the transmission of 100Mbps signals targeted to switch, router, hub, etc.
M-Series™ 56
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.
MXM 3.0 Connectors
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
NanoRF VITA 67.3 Connector System
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev®
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
Non-Magnetic RF Cable Assemblies
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.