IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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OCTIS™ - Hybrid Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies on a hybrid interface promote bother signal and power transmission over Cat 5e cable in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - Optical Solutions
FCI Basics OCTIS offers a range of optical solutions meeting ever-increasing bandwidth requirements. SFP version is interoperable with all types of SFP/SFP+ ports and suitable for high data rate applications over long lengths. QSFP version offers enhanced bandwidth (4X SFP/SFP+).
OCTIS™ - Power Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies using Amphenol's PwrProfile® interface promote high power transmission in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - RJ45 Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies using the RJ45 standard interface promote Ethernet-friendly signal transmission in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - Signal Connectors and Cable Assemblies (Metral® HDXS)
FCI Basics OCTIS™ I/O connectors and cable assemblies using Amphenol's Metral® HDXS interface promote signal and PoE++ transmission over Cat 5e and 6 cables in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCuLink Connector
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
Omni-Path Copper Cable Assemblies 100G
The Omni-Path verified DAC copper cables, are offered to address the needs of the majority of the inter-cabinet & short-reach intra-cabinet cable connections while minimizing cable bulk & cable routing issues, up to 4 meters using 30AWG cable. Longer-length cables up to 6 meters also maximize the length of copper. These longer cables use 26AWG high-performance bulk cable.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Copper Cable Assemblies 200G/400G
200G / 400G SOLUTIONS
Amphenol's leading the industry in OSFP cable development. OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with both 25G/ lane channel NRZ and 50G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G and 400G per cable assembly.
OSFP Loopback 200G/400G
OSFP (Octal SFP) Loopback Modules are part of our OSFP I/O system product family that includes copper cables, connectors, and AOC's. These OSFP loopback cable assemblies are offered in four configurations - Passive Electrical, Passive Thermal, Active Electrical, Active Thermal. All loopback cable assemblies support 200G (8 lanes @ 25G NRZ) or 400G (8 lanes @ 50G PAM4) signaling transmission.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
PC/104 Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 is a modular, ruggedized version of the PC 2.54mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PC/104 Plus Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 Plus is a modular, ruggedized version of the PC 2.00mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCS
The PCS Series are versatile, high-current, mixed density connectors with low contact resistance. It remains an industry-leading power connector in the market. Options for one, two, or three contact rows provide flexibility in selection and high conductivity contacts are available to maximize current density. Other options - sequential mating, integrated locking latch, and press-fit contacts.