IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Micro Power 3.0
Micro Power 3.0 connector system is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 6.5A per pin and a wire gauge range from 30AWG-20AWG. It is available in 2 to 24 circuits for dual rows and 2 to12 circuits for a single row. Scoop-proof housings prevent mismating between header and receptacle.
Micro Power Plus 3.0
Micro Power Plus 3.0 connector system, is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 12.5A per pin and wire gauge range from 30AWG-16AWG. It is available in 2 to 24 circuits for dual row and 2 to12 circuits for single rows.
Micro Power Super
Micro Power Super series is a 3.00mm pitch power connector designed for flexible wire-to-board applications, based on different wire gauges and circuits. It provides a maximum current rating of 17A/pin and accommodates a wire gauge of 16AWG and 15AWG. It is foolproof against mismating among different circuits. This series is available for 2 to 24 circuits for dual rows.
Micro SD and SD Card Sockets
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
Micro-TCA Card Edge Connectors
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES
MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
Millipacs® Mezzanine
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
Millipacs® Power & Hybrid Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® R/A Headers
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.