IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Termination Components
SV Microwave's termination components are essential elements in RF and microwave systems, designed to absorb and dissipate signals effectively. Terminations prevent signal reflections and maintain impedance matching, contributing to signal integrity. SV Microwave offers a variety of termination components with different power handling capabilities, frequency ranges, and connector options.
Termination Tools for RF Connectors
Amphenol RF offers a full line of termination tooling to meet your specific production requirements. All tools meet Amphenol’s stringent design and quality requirements and provide a consistent and reliable crimp each and every time, thereby ensuring the integrity of the connector termination.
TPA Fuses
With ratings up to 50A, TPA fuses enable the management of high-density/high-capacity equipment such as routers, DSLAMs, and powered SONET equipment.
UHF Connector Series
Originally intended for use as a video connector in radar applications, UHF coaxial connectors are general purpose units developed for use in low frequency systems from 0.6 - 300 MHz.
UltraPass™ OverPass™ Assemblies
224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS
UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market.
UltraPort™ QSFP+
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
UltraPort™ SFP+
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
(UQDB) Liquid Cooling Connector - SnapQDB
Amphenol LTW is a proud OCP Solution Provider. Our SnapQDB (UQDB) connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQDB requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】
(UQD G-Thread) Liquid Cooling Connector - SnapQD G-Thread
Amphenol LTW is a proud OCP Solution Provider. Our SnapQD G-Thread connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQD requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】
(UQD) Liquid Cooling Connector - SnapQD
Amphenol LTW is a proud OCP Solution Provider. Our SnapQD connectors are listed on the Open Compute Marketplace, offering reliable, meets and exceeds OCP UQD requirements, drip-free quick disconnects for high-performance liquid cooling connectivity【Quick Guide: https://amphenolltw.com/down.php?supp_download=116】