With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
The 240GT54/nrg240GT54 combination fuse panels are 240A dual-feed and provide 5/5 GMT fuse positions and 4/4 TPA fuse or circuit breaker positions. Engineered into a standard 1RU footprint, with circuits that support up to 20A GMT fuses and 50A TPA fuses or 60A breakers in each position, providing ample capacity for distribution to a broad range of components.
The 250TPA08/nrg250TPA08 fuse panels are 250A dual-feed and provide 8/8 TPA fuse positions. Engineered into a standard 1RU footprint, each circuit supports up to 50A TPA fuses in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
The 300CB08/nrg300CB08 circuit breaker panels are 325A dual-feed and provide 8/8 breaker positions. Engineered into a standard 1RU footprint, each circuit supports up to 60A breakers in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
Engineered for use in 1RU circuit breaker panels, these single-pole standard delay circuit breakers provide reliable circuit protection for DC applications from 5A to 60A. In addition to providing conventional overcurrent protection, each breaker can be used as an on-off switch.
Amphenol QSFP DD to QSFP DD 200G Active Optical Cable assemblies increase the number of lanes from 4 to 8 and double the port density as compared to 100G QSFP28 AOC. The QSFP DD AOCs operate up to 25Gb/s NRZ modulation and provide solutions up to 200Gb/s aggregate bandwidth, supporting 100meters over parallel multimode fiber.
HIGH DENSITY, EXCELLENT PERFORMANCE AND RELIABILITY
Amphenol's 300G CXP2 to CXP2 Active Optical Cable is a natural choice for optical cabling in data center/high-performance computing hardware applications, providing a cost-effective plug-and-play cabling solution. The CXP2 form factor delivers the highest hardware faceplate port density among existing SFF industry standards.
The 32G FC SW transceivers are designed to be used in Fibre Channel links up to 28.05 Gb/s data rate over multimode fiber. They are compliant with FC-PI-6a, SFF-8472 Rev 12.2c, and compatible with SFF-8432b and applicable portions of SFF-8431 Rev. 4.1d. These transceivers are RoHS compliant and per Directive 2011/65/EUe.
Amphenol provides a series of 40G QSFP+optical module products, including SR4, eSR4, IR4, LR4, ER4 lite, AOC and AOC breakout series. This series of products adopts LC or MPO optical port and is compatible with IEEE802.3bm, SFF-8436 and other standards; It has the characteristics of low power consumption, small size, high speed, and is applied to large data centers, campus networks, metropolitan area networ
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.
AgilLink™ 0.8mm wire-to-board connector is the most common solution for transferring low power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including, V/T SMT, and R/A SMT to meet various customer requirements. The compactness of the connectors allows for extensive usage in consumer applications.
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.