With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES
MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional pcb routing methods.