IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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InfinX®
The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.
InfinX Splice
InfinX Splice™ is the latest innovation from Amphenol Network Solutions designed to reduce the time and complexity of splicing high density rollable ribbon fiber cables. With fiber cable strand counts growing, and conduit space shrinking, rollable ribbon fiber is increasingly the choice of data center operators and Hyperscale network operators to address their growing bandwidth requirements.
Inside Plant Passives (ISP)
The product family includes optical muxes for DWDM and CWDM applications, co-existence modules, splitters, and optical TAPs for network monitoring. These optical circuits can be packaged in different forms, such as LGX style cassettes and C2 AOMs, to provide customers with maximum flexibility on the installation platform and component density required to service a wide range of applications.
IPS (Integrated Product Solutions) Series
Amphenol's IPS series is an integrated cable solution for high-speed card edge connectors like PCIe®. Compared to the traditional card-to-board application, this will extend the connection from simplified card-to-card to multiple gender options for connector-to-connector, connector-to-card, or card-to-card configurations.
ix Industrial™ IP20 Connectors
ix Industrial™ connectors enable IoT connectivity for Ethernet and other Industrial protocols through all levels of an operation from the Enterprise/Cloud to the sensors/actuators at the factory floor. These 10mm pitch connectors featuring 2-point metal latches are just 25% of the size of an RJ45 connector, and as such allow much greater port density and mating security.
Layered Fiber Demarcation Box (LFD)
Designed for high-density fiber connectivity and splicing for indoor wall mount applications. This compact plastic demarcation fiber enclosure is lightweight for easier handling. It can accommodate SC and LC style adapters and mass fusion splice sleeve holders.
LCX Bulkhead-Style Panel
The LCX Series features bulkhead-style, LGX-compatible fiber optic patch panels. The LCX gives you cost-effective patch and splitter capabilities in an industry-standard footprint. The series can host up to 288 terminations in a standard configuration that fits existing frame layouts and new builds.
Leap® On-Board Transceiver
SMALL, FAST AND POWER-EFFICIENT
Amphenol's 300Gb/s Leap®High-Speed Optical Module is faster, smaller, and more cost and power-efficient than most conventional data center interconnects.
LiNC™ Fiber Panel
The LiNC panel, patent-pending, is a revolutionary rapid-deployment multi-fiber end-to-end solution. It can easily lower fiber congestion, and it eliminates the need to store extra trunk cables or figuring out slack storage solutions. Four spools are built into the high-density chassis, and with the option of ready-to-use 12/24F MPO breakout modules integrated, you have up to 200
LiteTouch Solderless PCB Connectors
SV now offers a complete line of high frequency coaxial / surface mount PCB connectors that meet the industry need for high performing, highly reliable solderless connectors for precision thin substrate mounting. As frequencies increase and board substrates become thinner, the standard solderless PCB compression mount connectors can create undesirable results on thin (< .010”) dielectric PCB.