IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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M-Series™ 112Gb/s PAM4 BGA Mezzanine Connector
56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA) design, this connector offers a superior self-aligning and self-leveling solution. It incorporates a next-generation differential pair contact design, enabling exceptional performance of up to 56Gb/s NRZ and 112Gb/s PAM4.
M-Series™ VR 56Gb/s PAM4 BGA Mezzanine Connector
Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
mTACh Miniature 2-Channel Fiber Optic Connector
AFSI offers a high-performance, dual-channel hermaphroditic fiber optic connector, ideally suited for the energy, broadcast, and military markets. The mTACh connector is rugged yet compact. It is designed for use in tight spaces yet durable enough for applications requiring multiple mating cycles and harsh environments.
Multi-Trak™
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
MXM 3.0/4.0 Connectors
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry standard sockets. This helps to upgrade the graphics processor in a device, without changing the whole system or relying on proprietary vendor upgrades.
MXM 3.0 Connectors
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
NanoRF Modules, SOSA Aligned
SV Microwave expands its VITA connector portfolio with a new line of Backplane and Plug-In modules designed for the NanoRF connector system and fully aligned to the latest SOSA technical standard. Engineered for modern embedded computing platforms, these modules deliver ultra-high density, high-frequency RF performance and seamless modular interoperability.
NanoRF VITA 67.3 Connector System
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
Non-Magnetic RF Cable Assemblies
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.
nrgBDFB-XLW 1000A Battery Distribution Fuse Bay
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type Connector Series
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
OCP 48V BarKlip® BK150 IO
OCP 48V COMPATIBLE POWER CABLE ASSEMBLY FOR OPEN COMPUTE IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant Barklip® BK150 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and provide a convenient method of distributing up to 150A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK220 I/O
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 220A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK350 I/O
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK500 IO
Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. The connector system features two individual power circuits and two newly added secondary chassis grounding contacts.
OCP ORv3
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.
OCP ORv3 AC Input Connector and Cable Assemblies
DESIGNED FOR OCP'S V3 UNIVERSAL INPUT POWER DISTRIBUTION ARCHITECTURE STANDARDS
Amphenol's OCP-compliant AC Input Connectors and Cable Assemblies are designed to meet OCP's V3 Universal Input power distribution architecture standards and provide a convenient method of routing power directly from the busway to the power shelf within the V3 rack.
OCTIS™ - Hybrid Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies on a hybrid interface promote bother signal and power transmission over Cat 5e cable in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable.
OCTIS™ - Optical Solutions
OCTIS offers a range of optical solutions meeting ever increasing bandwidth requirements. SFP version is interoperable with all types of SFP/SFP+ ports and suitable for high data rate applications over long lengths. QSFP version offers enhanced bandwidth (4X SFP/SFP+).
OCTIS™ - Power Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies using Amphenol's PwrProfile® interface promote high power transmission in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - RJ45 Connectors and Cable Assemblies
OCTIS™ I/O connectors and cable assemblies using the RJ45 standard interface promote Ethernet-friendly signal transmission in outdoor and harsh environments like Remote Radio Units and small/macro cells. It offers lightning protection, EMI shielding, and is field-installable.
OCTIS™ - Signal Connectors and Cable Assemblies (Metral® HDXS)
OCTIS™ I/O connectors and cable assemblies using Amphenol's Metral® HDXS interface promote signal and PoE++ transmission over Cat 5e and 6 cables in outdoor and harsh environments like Broadband Wireless Access. It offers lightning protection, EMI shielding, and is field-installable.
OCuLink Connector
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
OLST Technology (Optimized Local Surface Treatment)
OLST Technology (Optimized Local Surface Treatment) combines the advantages of light metals – low weight, easy workability, etc. – with the advantages of copper, such as corrosion resistance, the property of being soldered, special features for electrical purposes.
Omni-Path Copper Cable Assemblies 100G
The Omni-Path verified DAC copper cables, are offered to address the needs of the majority of the inter-cabinet & short-reach intra-cabinet cable connections while minimizing cable bulk & cable routing issues, up to 4 meters using 30AWG cable. Longer-length cables up to 6 meters also maximize the length of copper. These longer cables use 26AWG high-performance bulk cable.
OneG Series RJ45 High-Speed Connectors - RJE7H
The RJE7H series of 1x1 Tab Down CAT5e jack connectors is one of the top-selling OneG series connectors from Amphenol. With a low profile, no-shield, and no-LED the connector aims to extend the application capability to suit a wide range of Communications, Storage, Consumer, Home, Industrial, and Medical markets.
Optik-D
"The Optik-D™ fibre-optic connector solution is for designers who need to terminate optical cable in harsh or challenging environments. It is an ARINC 801 conforming fibre-optic connector designed to be used with the Positronic Combo D-Subminiature family. Optik-D is more cost-effective than D38999 or ARINC 600-based systems and is compatible with ARINC 801 products from other manufacturers.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Cable Assemblies
mphenol is leading the industry in OSFP cable development. Our Electronics Products ʻProduct of the Yearʼ award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 224G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, 800G, and 1.6T per cable assembly.
OSFP OverPass™ Assemblies
DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
OSFP OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.
OSFP-XD Copper Cable Assemblies
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Paladin® 112Gb/s Backplane Cable
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® HD 224Gb/s Backplane Interconnect System
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
PanelMate™ Family
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
Panel Mount Connectors
SV Microwave's panel mount connectors are designed for robust and dependable RF connections. They are built to endure harsh environmental conditions and provide excellent durability during mating. These connectors are perfect for applications that require panel mounting, ensuring a secure RF connection in demanding environments.
Panel-Mounted Cable Assemblies
SV Microwave's new IP68-rated panel-mounted cable assemblies provide a rugged, high-performance solution for routing RF signals from an external, sealed interface to a high-density internal connection. Designed with an IP68-rated SMA female bulkhead on one end, these assemblies provide an environmental seal against dust and water ingress at the panel.
PCBA (Customised)
Amphenol BSI (ABSI) is providing customised PCBA solutions to the market leaders in the Automotive, Medical, Mobile Device, and IT Datacom sectors. With investments in SMT and Visual/Electrical Test equipment, ABSI operations can facilitate volumes from 10k per year up to 1.5m on a single part number. Passive Assemblies Examples: Display & I/O Boards,
PCB Connectors
SV Microwave's PCB connectors deliver high-speed signal integrity and easy integration onto printed circuit boards. They are designed to minimize signal distortion and ensure consistent electrical performance. These connectors are available in solderless and soldered attachment styles, with configurations in edge launch and surface mount to suit various applications.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCIe Over Optics- Linear Pluggable Optics (LPO)
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W
PCIe® Gen 4 M.2 1A Card Edge Connectors
Amphenol's PCIe® Gen 4 M.2 1A connectors provide 67 contacts on 0.50mm pitch and signal transmission speed of 16Gb/s. It occupies less board space, offers more connector height options. It is designed for PCIe® 4.0 1A applications, making it suitable for tablets, laptops and low profile storage and server applications.
PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge Connectors
Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. This fine-pitch solution offers multiple BTB applications like right-angle, mezzanine, and coplanar connectors. Cable options are available for a complete interconnect solution.
PCIe® Gen 6 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
PCIe® Gen 7 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.
PCIe® M.2 Gen 3 and Gen 4 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0, and SATA 3.0 applications, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCIe® M.2 Gen 5 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 5 Connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® Gen 5, making it suitable for tablets, laptops, and low-profile storage and server applications.