Board-Level Connectors

Amphenol is the first in the industry to offer card sockets for both microSD Express and Micro SD cards (UHS-I). The 17 pin microSD Express connector is capable of achieving high speeds up to 985MB/s and meeting PCIe® 3.0 requirements. The connector enables microSD Express platform to reach its full potential; making microSD Express card possible to serve as a removable Solid State Drive (SSD).

FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.

FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® cable connectors in standard 5+2 row configuration, transversal mounting on pin array

FCI Basics Compact PCI Millipacs® 2mm hard metric (HM) connectors are designed in accordance with IEC 61076-4-101 and fulfill the interconnection requirement of the Compact PCI bus architecture. Millipacs® range currently supports 10Gb/s and 25Gb/s data rate with backward mating compatibility to the standard 2mm HM IEC 61076-4-101 connectors.

FCI Basics offers Millipacs® speed (HS) right-angle receptacle suitable for data rate up to 25Gbps and with mating compatibility to the IEC 61076-4-101 series 2mm hard metric (HM) backplane header. The Millipacs HS receptacle and standard 2mm HM vertical header mating combination deliver low cross talk performance at higher frequencies.

FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.

FCI Basics Millipacs® Hard Metric Right Angle header Modules are available in all popular versions - Type A, B, C, B19, B22, AB22, and AB25 with options for top row shielding, high-temperature grade,

FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.

FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.