Board-Level Connectors

The 127/HE8 series is a medium-density range of multi-contact plug-in connectors for PCB. This range of 2.54 staggered grid, low profile connectors offers the widest range of hardware, guides, and contact terminations, providing more flexibility to PCB designers.

The 254 series is a double-sided, 2,54 [.100] pitch, range of connectors for printed circuit boards.

AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol ICC offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...

AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol ICC offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...

AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.

AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol ICC offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.

EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations. For bare or terminated wires Wire-to-board or wire-to-wire feed-through styles No special tools required for installation Easy field termination Flexible design options - contact us!

FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes. The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirements.

FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.

BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.

FCI Basics BergStak® 0.40mm self-alignment connectors come with a stack height of 3.50mm and 30 positions extendable up to 10 to 60 positions with 10 positions incremental. It has a unique self-alignment feature that supports blind mating, ensuring a reliable connection. The USCAR-2 compliant connector is also ideal for the automotive market.

The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.

FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.

FLEXIBLE SOLUTION FOR HIGH-DENSITY APPLICATIONS FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.

FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.

FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.

Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.