High Speed Connectors

DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.

ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

Amphenol Air LB France's SIM module for RJ45 Cat6a 10Gb can be used with the whole range of EN4165 / SIM Monomodule connectors. Available for cable-to-cable or cable-to-PCB applications. Rear accessories are available to provide a sealed connection.

The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.

The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.

The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.

The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.

ExaMAX® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.

The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.

The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.