Connectors
Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
View our businesses providing Connector solutions.
OCuLink Connector
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
Optik-D
"The Optik-D™ fibre-optic connector solution is for designers who need to terminate optical cable in harsh or challenging environments. It is an ARINC 801 conforming fibre-optic connector designed to be used with the Positronic Combo D-Subminiature family. Optik-D is more cost-effective than D38999 or ARINC 600-based systems and is compatible with ARINC 801 products from other manufacturers.
Optron Hybrid DS
Amphenol Fiber Systems International (AFSI) offers the Optron line of circular, hybrid (fiber optic/ electrical) connectors using proven M28876 technology. The high-precision engineered polymer insert provides optical performance superior to that of other hybrid connectors, particularly in high channel count configurations.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSP - AOM
ABS expands the capacity of fiber with a DWDM solution that combines simplicity, security, and reliability. The OSP-AOM along with the HiDT has been designed to handle high channel counts in a package that exploits and expands the capacity of many of the most popular OSP closures.
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
PC/104 Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 is a modular, ruggedized version of the PC 2.54mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PC/104 Plus Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 Plus is a modular, ruggedized version of the PC 2.00mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCIe® M.2 Gen 3 and Gen 4 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0, and SATA 3.0 applications, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCIe® M.2 Gen 5 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 5 Connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® Gen 5, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCI Express® Gen 3 Card Edge Connectors
Amphenol's 1.00mm pitch, vertical card edge connectors enable PCI Express® (PCIe®) signaling from 2.5Gb/s (Gen 1) and 5Gb/s (Gen 2) up to 8Gb/s (Gen 3) per differential signal pair. A modular design of these connectors allows standard pin counts like 36, 64, 98, 164, and 280.
PCI Express® Gen 4 and Gen 5 Card Edge Connectors
PCIe® Gen 4 and Gen 5 connectors outperform industry-standard PCIe® 4.0 and 5.0 (Proposed) requiring higher speed performance. The optimized series supports backward mating and is footprint compatible with PCIe 3/2/1. Amphenol's expansive range of vertical PCIe® Gen 4 and Gen 5 connectors will include options for SMT, through-hole solder, press-fit (PF), and straddle mount terminations.
PCS
The PCS Series are versatile, high-current, mixed density connectors with low contact resistance. It remains an industry-leading power connector in the market. Options for one, two, or three contact rows provide flexibility in selection and high conductivity contacts are available to maximize current density. Other options - sequential mating, integrated locking latch, and press-fit contacts.
Pegasus
Pegasus is Amphenol Pcd’s latest innovation in small, lightweight, rugged connectors. Designed for use in harsh environments, Pegasus builds on the successful Luminus Series Aerospace connector with the addition of EMI shielding. Tests show between 40db and 60db of attenuation, depending on frequency. RoHS and REACH compliant.
Pegasus High Speed
Pegasus High Speed provides exceptional performance in tight spaces, with a svelte shell size 8 (0.512”) outer diameter. With the explosive growth in Ethernet-enabled devices (IOT), this is size and configuration is particularly suited for endpoint applications, such as individual avionics sensors, panel-mounted units, seat back, and wall-mounted displays and monuments.
PHEN/PHEC Board-to-Board
PHEN/PHEC is a series of 1.27mm pitch board-to-board products that can tolerate a maximum misalignment of 1.3mm between the plug and receptacle. This ensures no damage to the housing or contact during angular mating. The tolerance is the result of the robustness of the housing design.