Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. Amphenol also offers a broad portfolio of contact styles, termination types, mating styles, connector geometries and environmentally-friendly RoHS plating.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.
XFP is a 30pos 0.8mm pitch SMT receptacle designed to support 10 Gigabit Fibre Channel and Gigabit Ethernet with the ability to extend performance to 14 Gbps. It is constructed from a metal frame and the cage assembly is to be bezel-mounted to an I/O panel with compliant pins for pressing onto the host PCB. Its single row cage configuration requires less space & is cost-optimized.
XFP 10G optical transceivers include SR, LR, ER, ZR and support Duplex, BiDi, CWDM, and DWDM solutions. They adopt an LC interface and are compatible with IEEE802.3ae, XFP MSA, and other standards. XFP 10G optical transceivers have the characteristics of low power consumption, small size, and high speed. They are most commonly used in Transmission, Storage Area Networks, and other environments.
Amphenol LTW's X-Lok Series connectors are presented in various sizes for power, signal, and hybrid applications for fast, simple, and reliable connections. Features a push-lock mechanism for intuitive mating with AUDIBLE and TACTILE feedback.
Amphenol LTW ZConnect® LV214-Compliant Connectors are low-profile connectors (8mm maximum mated height) for space-saving. ZConnect Connectors are robust enough to meet the automotive requirements of LV214 (VW75174). The series ranges from 8 to 40 contacts at 1A up to 120VDC with 0.9mm / 1.8mm / 2.7mm pitch. The connectors include mated and unmated versions and an IPx67 option.
Zeus series is a High voltage Din-Rail Connector that can be used as a high voltage terminal block. 5KV or 7KV Available in 2 or 3 contacts versions. Snap-in RADSOK Contact technology for 6AWG, 8AWG, and 12AWG. The connector is designed with Creepage/Clearance in accordance with5KV IEC60079-7 guidance
OUTDOOR LIGHTING RECEPTACLES, BASES, AND DOMES
The FLS Series products are compliant with Zhaga Book 18. The FLS Receptacle is designed with 4 contacts for Power, DALI, and Digital I/O, and mounts on a Luminaire. The mating FLS Base /Extension Module and Dome together form the housing for a Photocell/Sensor Module assembly.
The FLM Series products are compliant with the Zhaga Book 20. Zhaga Book 20 specifies 2 position connectors identified as Luminaire Extension Module Receptacles (LEX-MR) and Luminaire Plugs (LEX-LP), used for DALI-2 (Digital Addressable Lighting Interface) applications. DALI-2 is a smart interface protocol between indoor luminaires and sensors and communication modules.
Large current terminals have the advantages of simple structure, convenient installation, intuitive connection, more solid and reliable, and can be used as large current wiring of various electrical devices.