Printed Circuits
Amphenol is a leading design engineer and manufacturer to the printed circuit industry across all markets. Our capabilities are among the world’s most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission-critical applications. We custom design printed circuit boards (PCBs), rigid-flex assemblies, flex circuits, radio frequency (RF), backplane assemblies, and many others for high-speed, high-complexity and high-reliability system solutions.
View our businesses providing Printed Circuits solutions.
DOCSIS Passive
Accommodate 8+ STBs, MoCA controllers, and modems without power supplies or amplification. This means no more premises amplifiers and some serious noise reduction. Each DOCSIS Passive provides dramatic cost savings and cleans up the network.
Electronic Assemblies
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.
PCBA (Customised)
Amphenol BSI (ABSI) is providing customised PCBA solutions to the market leaders in the Automotive, Medical, Mobile Device, and IT Datacom sectors. With investments in SMT and Visual/Electrical Test equipment, ABSI operations can facilitate volumes from 10k per year up to 1.5m on a single part number. Passive Assemblies Examples: Display & I/O Boards,
Printed Circuit Boards
We provide our customers with mission-critical high reliability, competitively priced printed circuit products (rigid, flex, rigid-flex, backplanes, RF, and assemblies) that are: High Speed, High Complexity, High Mix, High Reliability, High Value.
Rigid Flex
We provide our customers with mission-critical high reliability, competitively priced printed circuit products (rigid, flex, rigid-flex, backplanes, RF, and assemblies) that are: High Speed, High Complexity, High Mix, High Reliability, High Value.