Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Amphenol has in-house capabilities to create application-specific mobile phone acrylic sheet lenses to fit our customer's precise needs. The sheet lenses are available as plastic or glass. Amphenol has over 10 years of acrylic sheet lens experience. Our lens capacity is over 12 million per month.
Amphenol's Audio Jacks are widely used in mobile phone applications. These connectors are available in different configurations, e.g. compressed type or for SMT solderable versions, and fully customized to the application requirements.
Amphenol’s comprehensive offering of battery connectors for mobile phones comes in single and multi-contact versions with straight and right-angle mountings. They feature stamp and form contacts with additional solder tags for high reliability and conductivity. Amphenol offers right angle and direct compression type, Wire to Board, board to board, blade type and float, or SMT versions.
The BTFW Series is a floating board-to-board connector system consisting of plugs and receptacles with two rows of staggered contacts on 1.00mm (0.039in.) centerlines. This connector system is designed for applications that require high density, and high reliability interconnects with higher pin counts and surface mount termination, such as audio-video (AV) and navigation systems in automobiles.
Amphenol's cable assemblies are widespread in the market for wearable products. These cable assemblies are used for data transfer and power charging. Amphenol's Charger Cable Solutions provide highly flexible customized connection solutions from standard USB 2.0/3.0 to the device side with Pogo pins or Spring. The connection mechanisms include magnetic, buckling, clamping, cradle, etc.
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.
FCI Basics the Clincher™ 2.54mm pitch connector family includes single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry. All receptacle connectors use the same customer-preferred and patented Clincher™ contact and are ideal for applications where shock or vibration are concerns.
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
Amphenol's double-sided lapping process provides the best solution for mobile device metal decorative logos. We can control part flatness tolerance within +/- 0.03mm and maintain a 1000N+ Laser weld bond between metal components. Our high-quality logos reflect a high brand value to customer end products.
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
eSATA connectors are designed for external storage applications that require a single-lane Serial ATA cable connection up to approximately two metres in length. The connectors comply with the Serial ATA Specification issued by the Serial ATA International Organization (SATA-IO). eSATA connectors support both Gen 1 (1.5Gb/s) and Gen 2 (3Gb/s) SATA data rates.
Ferrite is a ceramic compound composed of iron dioxide (Fe203), combined chemically with one or more metallic elements. Ferrite shields the metal parts of mobile phones so they do not absorb an electromagnetic field which results in a weak signal.
0.50mm pitch flex connectors utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications. These connectors are offered with top, bottom, dual beams & dual contact positions with both ZIF and Non-ZIF cable terminations. The connector series comes with a wide height range of 0.70mm to 5.80mm with 4 to 80 contact positions in both vertical and right angle orientations.
1.00mm pitch flex connectors utilize 1.00mm contact spacing to terminate displays and support complex board-to-board connections. These connectors are offered with top and bottom contact positions in both ZIF and Non-ZIF cable terminations. The connector series comes with a wide height range of 1.90mm to 5.04mm with 3 to 34 contact positions in both vertical and right angle orientations.